Unlock instant, AI-driven research and patent intelligence for your innovation.

Manufacture method of molding interconnection device

A manufacturing method and molding technology, applied in circuit substrate materials, printed circuit components, conductive pattern formation, etc., can solve the problems of difficult three-dimensional space processing, high mold development costs, and bottlenecks in mold development.

Inactive Publication Date: 2009-12-16
UNIMICRON TECH CORP
View PDF1 Cites 5 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The disadvantage of this technology is that it is difficult to process in three-dimensional space, and the cost of mold development is too high
The disadvantage of this technology is that there is a bottleneck in mold development, low design flexibility, and high development and manufacturing costs

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Manufacture method of molding interconnection device
  • Manufacture method of molding interconnection device
  • Manufacture method of molding interconnection device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0034] According to the prior art, whether it is laser direct structuring (LDS) or micro-integrated processing technology (MIPTEC), its disadvantages are the high cost of metal-containing plastic materials and production machines, and there is a wet process. pollution problem. Therefore, the present invention proposes a method for manufacturing an innovative and environmentally friendly molded interconnection device, which can effectively reduce process costs, and can be applied to various injection-molded three-dimensional plastic structures. Metallized circuit patterns can be formed on each surface of the device.

[0035] refer to figure 1 , which is a schematic diagram of a manufacturing method of a molded interconnection device drawn according to a preferred embodiment of the present invention. As shown in Figure 1, the plastic is first injection molded by using a mold, and then a plastic body 1 with patterned line groove structures 11, 12, 13 on the surface is formed, w...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a manufacture method of a molding interconnection device. The method comprises the following steps: providing a plastic body in injection molding, wherein the surface of the plastic body is in a groove structure provided with at least one patterning circuit; filling a conductive material in the groove structure of the patterning circuit; and directly forming a conductive circuit on the surface of the plastic body.

Description

technical field [0001] The present invention relates to a method for forming a circuit on a plastic surface, in particular to a method for manufacturing a molded interconnect device (MID). Background technique [0002] Those skilled in the art know that Molded Interconnect Device (MID) is a technology that manufactures three-dimensional metal wiring on a plastic injection-molded housing mechanism, which integrates mechanical and electronic functions, and is often used in hidden antenna housings of mobile phones or cameras. Module packaging, etc. [0003] At present, there are mainly the following methods for manufacturing molded interconnection devices, and their technical contents and shortcomings are sorted out as follows: [0004] (1) Laser direct structuring (LDS): As disclosed in US Patent Publication 2007 / 024822, a plastic doped with a metal catalyst is used to activate it with a laser, and then a chemical copper metallization process is performed. The disadvantage o...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/10H05K1/03
Inventor 余丞宏李奇恩
Owner UNIMICRON TECH CORP