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Image sensor module and camera module

A technology of image sensor and camera module, which is applied in the direction of camera, camera body, instrument, etc., can solve the problems of bad image stability of camera module and high heat generation of camera module, so as to improve stability and Effects of image quality, image noise reduction, and high heat dissipation efficiency

Inactive Publication Date: 2009-12-23
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the continuous improvement of the resolution of the image sensor, the efficiency and data processing capability of the image data processing are required to be higher and higher. If it gets bigger and bigger, it will cause the image sensor module and even the camera module to generate too much heat, which will have a negative impact on the imaging stability of the camera module.

Method used

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  • Image sensor module and camera module
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  • Image sensor module and camera module

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Embodiment Construction

[0011] The embodiments of the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0012] See Figure 1 to Figure 3 The camera module 100 provided by the embodiment of the present invention includes a lens module 10, a lens holder 20, and an image sensor module 30.

[0013] The lens module 10 includes a lens barrel 11 and a plurality of lenses 12 arranged in the lens barrel 11. The lens barrel 11 is a cylindrical body with opposite inner and outer walls 13. The outer wall 13 of the lens barrel may be provided with external threads to cooperate with the lens holder 20 to be assembled.

[0014] The lens holder 20 is a cylindrical shape below the upper circle. The upper end of the lens holder 20 is cylindrical to be assembled with the lens barrel 11 and partially accommodates the lens barrel 11. Corresponding to the outer wall 13 of the lens barrel 11, the upper inner wall 21 of the lens holder 20 may be provided with an internal...

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Abstract

The invention relates to an image sensor module which comprises an image sensor, a heat conducting substrate and a heat pipe structure, wherein the image sensor is arranged on the heat conducting substrate; and the heat pipe structure comprises an evaporating end, a condensing end, an upper substrate and a lower substrate, wherein the heat conducting substrate is heatedly connected with the evaporating end of the heat pipe structure; the upper substrate is opposite to the lower substrate; grooves are formed in the upper substrate and the lower substrate and are used for containing working fluid; and the upper substrate and the lower substrate are mutually sealed to seal the working flui in the space formed by the grooves of the upper substrate and the lower substrate. The invention also provides a camera module using the image sensor module.

Description

Technical field [0001] The invention relates to an image sensor module, in particular to an image sensor module with higher heat dissipation efficiency and a camera module adopting the image sensor module. Background technique [0002] With the development of multifunctional electronic products, camera modules have been widely used in consumer electronic products such as mobile phones, notebook computers, digital cameras, and personal digital assistants. While people are pursuing multi-functionality, they also hope that electronic products have excellent image effects, that is, camera modules are required to have high-quality imaging quality, which leads to continuous improvements in the resolution and imaging quality of camera modules. Meet people's higher requirements. [0003] With the continuous improvement of the imaging quality of the camera module, the research and design of the image sensor module, which is a key component for imaging and processing image information, is ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/146H01L23/427H04N5/225G02B7/02G03B17/55
CPCH01L27/14618H01L27/14625H01L2924/0002H01L2924/00
Inventor 张仁淙
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD