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System and method for floor covering installation

A technology for floors and floor tiles, applied in the field of floor installation systems, to achieve the effect of reducing installation time

Active Publication Date: 2009-12-30
INTERFACE INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0016] The present invention solves the problems of previous modular flooring installation methods by providing a system and method that reduces the time and material costs required to install the flooring

Method used

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  • System and method for floor covering installation
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Embodiment Construction

[0042] The present invention relates to systems and methods for installing floors. Those skilled in the art will understand that the systems and methods described herein can be used in a variety of floor installations. However, applicants have found that the connectors described herein are particularly useful in any type of installation, including wall-to-wall and sub-floor installations, of modular flooring units (hereinafter "tiles"). The floor tiles are available in a variety of colors and textures, and within a range of sizes and shapes. For example, individual floor tiles may be shaped to mimic wood floors or ceramic shapes, and other floor tiles include, but are not limited to, hexagonal, square, rectangular, triangular, and other shapes. Additionally, the floor tiles can be of various textures. The floor tiles of the present invention are typically conventional floor tiles with woven faces (including but not limited to tasseled, bonded and printed faces), but can also...

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PUM

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Abstract

The invention relates to a system and a method for installing modular tiles, each having an underside, on a floor surface without attaching the tiles to the floor surface, the system comprising connectors each comprising: a. a film, which can be configured to resist stretching when bearing tensioning force; b. a layer of releasable adhesive located on a side of the film, wherein the layer of adhesive is capable of forming a bond with the undersides of the tiles. The invention also provides a plurality of connectors and floors for installing.

Description

[0001] This application is a divisional application of the application with the national application number "2005800426107" and the title of the invention "system and method for installing floors" submitted on October 17, 2005. [0002] Cross References to Related Applications [0003] This application claims U.S. Provisional Application No. 60 / 619340, filed October 15, 2004, entitled "System and Method for Installing Floors," filed December 21, 2004, and entitled "System for Installing Floors" Priority to U.S. Patent Application No. 11 / 018947, and Provisional Application No. 60 / 690762, filed June 15, 2005, entitled "System and Method for Installing Floors," which are hereby incorporated by reference combined. technical field [0004] The present invention relates to systems and methods for installing floor coverings, particularly including carpet tile and other modular flooring. Background technique [0005] Flooring has been in use since before recorded human history. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): E04F15/02B65H37/00C09J7/02A47G27/04C09J7/38
CPCA47G27/0487B65H2701/1922C09J7/0207C09J2203/314B65H2402/411B65H37/005B65H2701/194E04F15/02C09J2433/00A47G27/0481C09J7/38
Inventor G·A·H·斯科特D·D·奥亚基J·P·布拉福德K·N·格雷C·科奇兰
Owner INTERFACE INC
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