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Uniform temperature plate and manufacturing method thereof

A manufacturing method and technology of a temperature equalizing plate, which are applied to lighting and heating equipment, indirect heat exchangers, etc., can solve problems such as affecting the return efficiency of working fluid, and achieve the effects of strengthening support strength, reducing overall thickness, and increasing return speed.

Active Publication Date: 2009-12-30
NIDEC CHAUN-CHOUNG TECH CORP
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  • Abstract
  • Description
  • Claims
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Problems solved by technology

However, the support member 2a is not provided with any capillary tissue, so that the working fluid can only flow back around the inner wall of the housing 1a, seriously affecting the return efficiency of the working fluid

Method used

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  • Uniform temperature plate and manufacturing method thereof
  • Uniform temperature plate and manufacturing method thereof
  • Uniform temperature plate and manufacturing method thereof

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Embodiment Construction

[0041] The detailed description and technical content of the present invention are described below with accompanying drawings. However, the attached drawings are provided for reference and illustration only, and are not intended to limit the present invention.

[0042] The invention provides a uniform temperature plate and its manufacturing method, please refer to figure 2 Shown, is the production flow diagram of uniform temperature plate (Vapor Chamber) of the present invention, and its steps comprise:

[0043] Step a, the inner wall surface of the first plate body 1 is covered with a layer of capillary tissue 12 (such as image 3 shown); in this step, the metal powder can be directly molded on the inner wall surface of the first plate body 1 by sintering to obtain a layer of capillary structure 12; similarly, the metal braided mesh can also be adhered by welding or the like combined with the inner wall surface of the first plate body 1;

[0044] Step b, two or more capill...

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Abstract

The invention provides a manufacturing method of a uniform temperature plate, comprising the following steps: covering a capillary tissue layer on the inner wall surface of a first plate body; combining two or more than two capillary support posts on the inner wall surface of a second plate body; mutually overlapping and hermetically jointing the first plate body and the second plate body, and forming a vapour containing cavity in a jointed body of the first plate body and the second plate body; filling work fluids into the vapour containing cavity, eliminating gas contained in the work fluids, and then closing an opening of the vapour containing cavity. Besides, the invention also provides the uniform temperature plate manufactured by the method. The service life of the uniform temperature plate in prolonged by enhancing the support strength of the uniform temperature plate, increasing the back flow speed of the work fluids, effectively thinning the uniform temperature plate and enlarging the vapour space inside the vapour containing cavity.

Description

technical field [0001] The invention relates to a uniform temperature plate, in particular to a uniform temperature plate used for electronic heating components and a manufacturing method thereof. Background technique [0002] At present, with the rapid development of the technology industry, computers are getting faster and faster in computing execution, especially when the computing speed of the central processing unit is higher, the heat generated during its operation is also getting higher and higher. This intensive heat is effectively dissipated to the environment outside the host to keep the CPU operating at a permissible temperature. Usually, a cooling device is provided on the CPU to assist the CPU in dissipating heat to increase heat dissipation. However, as the computing speed of the central processing unit is higher, the heat generated is also higher and higher. If the general cooling device is still composed of an extruded aluminum radiator and a cooling fan, it ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F28D15/02B22F7/02
Inventor 黄孟正王证都
Owner NIDEC CHAUN-CHOUNG TECH CORP
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