Electrolytic tin plating solution and electrolytic tin plating method

A technology for electrolysis of tin and plating solution, which is applied to electrolysis components, electrolysis process, circuits, etc., can solve the problems of difficulty in treatment of plating solution wastewater and washing water, and achieve the effects of easy wastewater treatment, preventing deformation, and improving product yield.

Active Publication Date: 2010-01-06
ROHM & HAAS ELECTRONICS MATERIALS LLC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, the plating solution of Japanese Unexamined Patent Application 2003-82492 includ

Method used

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  • Electrolytic tin plating solution and electrolytic tin plating method
  • Electrolytic tin plating solution and electrolytic tin plating method
  • Electrolytic tin plating solution and electrolytic tin plating method

Examples

Experimental program
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Effect test

Embodiment 1

[0071] The plating bath was formed using a tin plating solution having the following composition:

[0072] (A) stannous methanesulfonate (as tin ion) 12g / L

[0073] (B)(A) Methanesulfonic acid (as free acid) 50g / L

[0074] (C) Amine oxides: derived from ethylene oxide, methyl-, polymers with ethylene oxide, with 2,2'-(imino oxide)bis[ethanol](2:1)N-[3 -(C9-11-isoalkoxy)propyl] ether (oxirane, methyl-, polymerwith oxirane, ether 2, 2'-(oxidoimino)bis[ethanol](2:1)N-[3-(C9 -11-isoalkyloxy)propyl]derived) 10g / L

[0075] (D) Benzylidene acetone 0.4g / L

[0076] (E) Methacrylic acid 2g / L

[0077] (F) Sodium 2-naphthol-7-sulfonate 0.5g / L

[0078] (G) Potassium hydroquinone sulfonate 2g / L

[0079] (H) Distilled water balance

[0080] Under the conditions shown below, tin barrel plating was performed on nickel-plated chip resistors with 1 L of tin plating solution, and then various evaluations were performed. The results are shown in Table 1.

[0081] barrel

[0082] Platin...

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Abstract

A plating solution and a plating method, which does not use a complexing agent and which provides favorable solder wetting properties and an extremely low coupling rate when electrolytic tin plating is performed, and particularly when electrolytic tin plating is performed using a barrel plating method. The present invention provides an electrolytic tin plating solution for chip components, comprising (A) stannous ions, (B) acid, (C) N,N-dipolyoxy-alkylene-N-alkyl amine, amine oxide, or blend thereof and (D) an anti-sticking agent; wherein the pH is 1 or lower.

Description

technical field [0001] The present invention relates to a tin plating solution and an electrolytic tin electroplating method; in more detail, it relates to an electrolytic tin plating solution and an electrolytic tin electroplating method for plating chip components such as ceramic capacitors. Background technique [0002] The chip element is a metal plated with tin, copper, silver, gold, nickel, palladium or alloys thereof, which is plated using an electroplating method such as barrel plating, electroplating with a flow-through plating device, etc., Depends on the shape of the chip and the configuration of the area to be plated. The purpose of tin plating is to provide solderability to the electrode portion of the chip component. [0003] However, the use of tin plating, especially barrel plating, raises the problem of mutual adhesion (hereinafter also referred to as coalescence, sticking and bonding) of chip components. Chips bonded together become defective products, re...

Claims

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Application Information

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IPC IPC(8): C25D3/32
CPCC25D3/30C23C18/54C25D7/12C23C18/18C25D17/16
Inventor 今成真明丁辉龙嶋津元矢太田康夫
Owner ROHM & HAAS ELECTRONICS MATERIALS LLC
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