Semiconductor module and inverter apparatus

A semiconductor and substrate technology, applied in the field with a base plate, which can solve the problems of reduced cooling performance of the switching element 106, easy occurrence of thermal interference, and temperature rise of the base plate 102, etc.

Inactive Publication Date: 2010-01-06
AISIN AW CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the heat conducted from the plurality of switching elements 106 is prone to thermal interference on the base plate 102, which often causes the temperature of the base plate 102 to rise locally.
At this time, in a region where the temperature of the base plate 102 is high, the cooling performance of the switching element 106 disposed in the region may decrease.

Method used

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  • Semiconductor module and inverter apparatus
  • Semiconductor module and inverter apparatus
  • Semiconductor module and inverter apparatus

Examples

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no. 1 approach

[0040] A first embodiment of the present invention will be described with reference to the drawings. In this embodiment, an example in which the present invention is applied to the semiconductor module 1 as an inverter device constituting a three-phase AC inverter circuit will be described. Figure 1 to Figure 8 It is a figure for demonstrating the structure of the semiconductor module 1 of this embodiment. Also, in Figure 1 to Figure 5 In , configurations other than the substrate 3 above the bottom plate 2 are omitted.

[0041] As shown in these figures, this semiconductor module 1 has a cooling structure including a coolant flow path 7 for cooling the switching element 4 of the substrate 3 placed on the upper surface 2A of the base plate 2, especially the most heat-generating. Allow to cool. Additionally, if Figure 6 As shown, this semiconductor module 1 constitutes an inverter circuit 11 for driving a three-phase AC motor 31 . Therefore, if figure 1 As shown, six s...

no. 2 approach

[0069] A second embodiment of the present invention will be described with reference to the drawings. Figure 9 It is a plan view showing the configuration of the main part of the semiconductor module 1 of the present embodiment. As shown in this figure, the semiconductor module 1 of this embodiment is configured such that only one set consisting of a pair of lower arm substrate 3A and upper arm substrate 3B is placed on one base plate 2 . That is, the semiconductor module 1 of this embodiment differs from the above-mentioned first embodiment in the number of substrates 3 mounted on one base plate 2 . In addition, the point which is not specifically demonstrated in this embodiment can be the same as the structure of the said 1st embodiment.

[0070] Therefore, in the semiconductor module 1 of this embodiment, compared with the semiconductor module 1 of the first embodiment, the width in the vertical direction C of the base plate 2 is narrowed, and the overall width W of the c...

no. 3 approach

[0072] A third embodiment of the present invention will be described with reference to the drawings. Figure 10 It is a plan view showing the configuration of the main part of the semiconductor module 1 of the present embodiment. The semiconductor module 1 of this embodiment is mainly different from the above-mentioned first and second embodiments in the configuration of the arrangement of the substrate 3 . Here, for the sake of simplification of drawings and the like, as in the above-mentioned second embodiment, only one set of a pair of substrates 3A, 3B is placed on one base plate 2 for description. In the same manner, it is also applicable to a configuration in which a pair of substrates 3A, 3B is used as a set and a plurality of sets of substrates 3 are placed on the bottom plate 2 . In addition, regarding the points not particularly described in this embodiment, the same configuration as that of the above-mentioned first embodiment or second embodiment can be employed. ...

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Abstract

Provided is a semiconductor module having a structure capable of suppressing the thermal interference between switching elements on each pair of substrates on a base plate and appropriately cooling the switching elements on all of the substrates. Parallel flow generating means (8) for generating parallel flows of a refrigerant are arranged in refrigerant flow paths (7). Each substrate (3) has thereon the switching element (4) and a diode element (5) such that those elements are disposed in parallel in a direction (C) orthogonal to a direction (D) in which the refrigerant flows. On each substrate, the switching element (4) and a connection terminal area (6) are arranged in different positions in the refrigerant flowing direction (D). Each pair of the substrates (3) are disposed in series in the refrigerant flowing direction (D). In one substrate (3) of each pair, the switching element (4) is arranged on one side in the orthogonal direction (C), and in the other substrate (3), the diode element (5) is disposed on that same side in the orthogonal direction (C). In at least one substrate (3) of each pair, the connection terminal area (6) is disposed closer to the other substrate (3) than the switching element (4) on that substrate (3).

Description

technical field [0001] The present invention relates to a base plate; a plurality of substrates mounted on one side of the base plate and provided with switching elements, diode elements, and connection terminal regions; and a coolant flow path provided in contact with the other side of the base plate. Semiconductor modules and inverter devices. Background technique [0002] For example, in an inverter circuit for driving a high-power output motor used in a hybrid vehicle, an electric vehicle, etc., a semiconductor module provided with a switching element constituting the inverter circuit generates a large amount of heat. , is also required to be miniaturized. Therefore, as a cooling structure for semiconductor modules, a water cooling system is often used. As a configuration of such a water-cooled semiconductor module, for example, the one disclosed in the following Patent Document 1 Figure 15 composition shown. In this figure, (a) is a top view, (b) is a side view, and...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/07H01L23/473H01L25/18H02M7/48
CPCH01L25/16H01L23/473H01L2224/291H02M7/003H01L25/072H01L2224/32225H01L2924/13055H01L2924/1305H01L2924/014H01L2924/00
Inventor 青木一雄鹤冈纯司安井诚二
Owner AISIN AW CO LTD
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