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Power module and substrate structure applied to power module

A technology of substrate and electric power, applied in the direction of transforming equipment structural parts, circuits, electrical components, etc., can solve problems such as interference, increased thermal stress, and increased operating temperature, and achieve the effect of suppressing uneven thickness

Pending Publication Date: 2021-06-11
HYUNDAI MOTOR CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since the gap between semiconductor devices is reduced, the heat generated when the semiconductor devices are in operation causes disturbance, which leads to a problem that the operating temperature of the semiconductor device increases or the thermal stress increases at the junction where the devices constituting the power module are bonded

Method used

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  • Power module and substrate structure applied to power module
  • Power module and substrate structure applied to power module
  • Power module and substrate structure applied to power module

Examples

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Embodiment Construction

[0036] The advantages and features of the present disclosure and a method of achieving the advantages and features of the present disclosure will become apparent by referring to exemplary embodiments which will be described in detail hereinafter with reference to the accompanying drawings. However, the present disclosure is not limited to the exemplary embodiments described below but can be implemented in various ways, and the exemplary embodiments are provided to make the description of the present disclosure complete and to fully understand the scope of the present disclosure to those skilled in the art, and The present disclosure is defined by the claims. Throughout the specification, the same reference numerals refer to the same components.

[0037] The terms "~ unit", "~ device" and the like used herein represent a unit for processing at least one function or operation, and may be realized by hardware, software, or a combination of hardware and software.

[0038] Through...

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PUM

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Abstract

An embodiment of the present disclosure provides a substrate structure applied to a power module. In the substrate structure applied to a power module, the substrate includes an upper substrate and a lower substrate, a plurality of semiconductor devices disposed on the lower substrate, a source signal electrode transmitting a source signal to the semiconductor devices, and a gate signal electrode transmitting a gate signal to the semiconductor devices, one of the source signal electrode or the gate signal electrode is connected to the upper substrate through a conductive column, and a signal transmitted by one of the source signal electrode or the gate signal electrode is transmitted to the semiconductor devices through the upper substrate.

Description

technical field [0001] The present disclosure relates to a power module having conductive posts electrically connecting a lower substrate and an upper substrate and a substrate structure suitable for the power module. Background technique [0002] A power conversion device (for example, an inverter), which is one of core components of hybrid vehicles and electric vehicles, is a main component of eco-friendly vehicles, and many technologies are being developed. Development of a power module, which is a core component of a power conversion device and occupies the highest cost, is a core technology in the field of eco-friendly vehicles. [0003] A plurality of semiconductor devices may be mounted in the power module. When current is applied to the power module, the current is applied to a plurality of semiconductor devices, and the semiconductor devices convert the applied current. Therefore, when the currents respectively applied to the semiconductor devices of the power mod...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/07H01L23/467H02M7/00H02M7/48
CPCH01L25/072H01L23/467H02M7/003H02M7/48H01L23/5386H01L23/5385H01L23/49531H01L23/49562H01L23/49575H01L23/3735H01L2224/48227H01L23/14H01L23/495H01L23/49H01L24/42H01L25/16H01L25/0652H01L29/772H01L23/49568H01L23/49503H01L23/4952
Inventor 洪坰国金永锡
Owner HYUNDAI MOTOR CO LTD
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