Semiconductor module and inverter apparatus

Abstract

Provided is a semiconductor module having a structure capable of suppressing the thermal interference between switching elements on each pair of substrates on a base plate and appropriately cooling the switching elements on all of the substrates. Parallel flow generating means (8) for generating parallel flows of a refrigerant are arranged in refrigerant flow paths (7). Each substrate (3) has thereon the switching element (4) and a diode element (5) such that those elements are disposed in parallel in a direction (C) orthogonal to a direction (D) in which the refrigerant flows. On each substrate, the switching element (4) and a connection terminal area (6) are arranged in different positions in the refrigerant flowing direction (D). Each pair of the substrates (3) are disposed in series in the refrigerant flowing direction (D). In one substrate (3) of each pair, the switching element (4) is arranged on one side in the orthogonal direction (C), and in the other substrate (3), the diodeelement (5) is disposed on that same side in the orthogonal direction (C). In at least one substrate (3) of each pair, the connection terminal area (6) is disposed closer to the other substrate (3) than the switching element (4) on that substrate (3).

Description

technical field [0001] The present invention relates to a base plate; a plurality of substrates mounted on one side of the base plate and provided with switching elements, diode elements, and connection terminal regions; and a coolant flow path provided in contact with the other side of the base plate. Semiconductor modules and inverter devices. Background technique [0002] For example, in an inverter circuit for driving a high-power output motor used in a hybrid vehicle, an electric vehicle, etc., a semiconductor module provided with a switching element constituting the inverter circuit generates a large amount of heat. , is also required to be miniaturized. Therefore, as a cooling structure for semiconductor modules, a water cooling system is often used. As a configuration of such a water-cooled semiconductor module, for example, the one disclosed in the following Patent Document 1 Figure 15 composition shown. In this figure, (a) is a top view, (b) is a side view, and...

AI Technical Summary

Problems solved by technology

Therefore, the heat conducted from the plurality of switching elements 106 is prone to thermal interference on the base plate 102, which often causes the temperature of the base plate 102 to rise locally.

At this time, in a region where the temperature of the base plate 102 is high, the cooling performance of the switching element 106 disposed in the region may decrease.

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