Wire feeding/drawing device and method thereof

Abstract

The invention relates to a wire feeding / drawing device and a method thereof, which are used for feeding gold wires to a wire-welding machine. The wire feeding / drawing device comprises an electric motor component, a coil rack component and a conducting wire component, wherein a gold wire coil is assembled on the coil rack component; and a gold wire can pass through the conducting wire component. The conducting wire component comprises at least one air nozzle component, an upper wire-passing plate and a lower wire-passing plate matched with the upper wire-passing plate, wherein a gap is reserved between the upper wire-passing plate and the lower wire-passing plate; and an air nozzle faces the gap. The electric motor component drives the coil rack component to release the gold wire, and the gold wire passes through the gap and reaches the wire-welding machine. As the gold wire is light, the releasing stress equilibrium of the gold wire is disturbed, and the blowing of the air nozzle component of the conducting wire component can ensure that the gold wire in the gap can quickly and automatically achieve stress equilibrium so as to maintain the feeding track of the gold wire. Meanwhile, by adjusting the air flow of the air nozzle component, the tension of the gold wire can be controlled, thereby solving the problems of the scratch, deformation and even breakage of the gold wire andimproving the smoothness of wire feeding and the efficiency of welding.

Description

【Technical field】 [0001] The invention relates to a wire feeding and pulling device used on semiconductor gold wire welding packaging equipment. 【Background technique】 [0002] In the semiconductor gold wire welding equipment, whether the gold wire can be fed smoothly directly affects the quality of the welding and the stability of the machine work. When the gold wire is fed, it must not only meet the feeding requirements, but also make the gold wire follow a certain trajectory. At the same time, because the diameter of the gold wire used for lead frame welding is quite thin, the thinnest is only 1mil, which increases the difficulty of wire feeding. In the process of wire feeding, it is necessary to ensure that the gold wire maintains a certain tension and cannot Rigid contact causes scratches or deformation of the gold wire, which affects the smoothness of the gold wire feeding. 【Content of invention】 [0003] The technical problem to be solved by the present invention l...

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Problems solved by technology

[0002] In the semiconductor gold wire welding equipment, whether the gold wire can be fed smoothly directly affects the quality of the welding and the stability of the machine. When the gold wire is fed, it must not only meet the feeding requirements, but also make the gold wire follow a certain trajectory. At the same time, because the diameter of the gold wire used for lead frame welding is quite thin, the thinnest is only 1mil, which increases the difficulty of wire feeding. In the process of wire feeding, it is necessary to ensure that the gold wire maintains a certain tension and cannot Rigid contact will cause the gold wire to be scratched or deformed, thus affecting the smoothness of the gold wire feeding

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