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Method and apparatus for joining protective tape to semiconductor wafer

A technology for pasting devices and protective tapes, which is applied in semiconductor devices, semiconductor/solid-state device manufacturing, adhesives, etc., and can solve problems such as wafer damage

Inactive Publication Date: 2010-02-17
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At this time, the pressing force of the thermally expanded air bubbles in the interface acts on the side of the wafer that has become thinner and lowered in rigidity, causing the wafer to be damaged.

Method used

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  • Method and apparatus for joining protective tape to semiconductor wafer
  • Method and apparatus for joining protective tape to semiconductor wafer
  • Method and apparatus for joining protective tape to semiconductor wafer

Examples

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Embodiment Construction

[0054] In order to explain the invention, some aspects considered to be preferable at present are shown in the drawings, but it should be understood that the invention is not limited to the configurations and aspects as shown in the drawings.

[0055] Embodiments of the present invention will be described below with reference to the drawings.

[0056] figure 1 It is a perspective view showing the overall structure of the protective tape sticking device.

[0057]This protective tape sticking device includes a wafer supply / recovery section 1 filled with a cassette C containing semiconductor wafers (hereinafter referred to simply as "wafers") W, a wafer transport mechanism 3 having a robot arm 2, an alignment table 4, a suction The holding table 5 that holds the placed wafer W, the tape supply unit 6 that supplies the protective tape T toward the upper side of the wafer W, and the protective tape T with the separator sheet supplied from the tape supply unit 6 are peeled, recove...

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PUM

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Abstract

A protective tape is supplied above the surface of a semiconductor wafer, and joined to the surface of the semiconductor wafer by rolling a joining roller while pressing the joining roller against theprotective tape. Then the joined protective tape is cut out along the outer periphery of the semiconductor wafer. Subsequently, the protective tape is pressed with the pressure member to flatten thesurface of the protective tape.

Description

technical field [0001] The present invention relates to a method and an apparatus for attaching a protective tape to a semiconductor wafer for attaching a protective tape to the surface of a semiconductor wafer subjected to a process of forming a circuit pattern. Background technique [0002] Manufacturing of chip components from a semiconductor wafer (hereinafter simply referred to as "wafer") is performed using the following procedure. A circuit pattern is formed on the surface of the wafer, and a protective tape is pasted on the surface of the wafer. Thereafter, the back surface of the wafer is ground (back grinding) to reduce its thickness. Wafers that have been thinly processed are adhered and held on ring holders through dicing tape. Thereafter, the protective tape on the surface of the wafer is peeled off and transported to the dicing process. [0003] As a method of sticking the protective tape on the surface of the wafer, the examples were carried out as follows....

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/00
CPCH01L21/6836H01L2221/68327H01L21/67132Y10T156/10Y10T156/12H01L21/48H01L21/78
Inventor 奥野长平山本雅之宫本三郎
Owner NITTO DENKO CORP