Printed circuit board (PCB) and manufacturing method thereof and device for solving reflux of radio-frequency power amplifier

Abstract

The invention relates to a printed circuit board (PCB), and discloses the printed circuit board (PCB), a manufacturing method thereof and a device for solving reflux of a radio-frequency power amplifier, wherein the PCB comprises multiple monolayer PCB; a first surface of the PCB is adhered with surface copper sheet; one reference monolayer PCB of the PCB is adhered with reference copper sheet corresponding to the surface copper sheet; the reference monolayer PCB is different from the monolayer PCB adhered with surface copper sheet; the PCB comprises a slit ladder the depth of which is less than the thickness of the PCB and is no less than the thickness of a second surface in which the reference copper sheet and the opening of the slit ladder are located; the side wall of the slit ladder is adhered with side wall metal which is electrically connected with the reference copper sheet, and the side wall metal is electrically connected with the slit ladder at the opening position of the second surface. By adopting the above technical scheme, a large-area ladder groove is not required to use, thus cost is reduced.

Description

[0001] This application claims the priority of the Chinese application filed on August 12, 2008, with the application number 200810134658.6, and the title of the invention is "Printed circuit board and its manufacturing method, and a device for solving the backflow of radio frequency power amplifier", the entire content of which is incorporated by reference in this application. technical field [0002] The invention relates to a printed circuit board, in particular to a printed circuit board, a manufacturing method, and a device for solving the backflow of a radio frequency power amplifier. Background technique [0003] With the miniaturization and low-cost requirements of printed circuit board (PCB: Printed Circuit Board) products becoming more and more urgent, the common board design of base station boards including power amplifiers has become an important development trend in the industry's product realization forms; including power amplifiers, radio frequency The common-...

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Problems solved by technology

[0005] In the process of realizing the present invention, the inventors have found that there are at least the following defects in the above-mentioned technical scheme: due to the use of large-area stepped grooves, there are three sintering surfaces between the sintered block, the printed circuit board and the power amplifier tube (the same as the power amplifier tube method) The contact surface of the blue plate, the contact surface with the reference formation, and the contact surface with the bottom surface of the printed circuit board), so there is a precision requirement for the processing tolerance of the sintered surface, which increases the processing cost; at the same time, due to the use of large-area stepped grooves , it is necessary to control the shrinkage ratio of different media of the printed circuit board and the warpage of the single board, which further increases the processing cost. At the same time, the requirements for the material of the board at the stepped groove are also relatively high, which increases the cost of raw materials

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