Method for manufacturing halogen-free FR-4 copper-clad laminate
A technology of FR-4, manufacturing method, applied in the direction of adhesive heating, bonding method, lamination, lamination device, etc., can solve the problems of ozone layer destruction, human and environmental hazards, etc., to achieve improved processing performance, good resistance The effect of flammability
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Embodiment 1
[0054] 1. Mixing formula:
[0055] Phosphorus-containing epoxy resin (P: 2.0%) 133
[0056] Dicyandiamide 3.0
[0057] Dimethylformamide 30
[0058] Dimethylimidazole 0.070
[0059] Aluminum hydroxide 35
[0060] Silica 5
[0061] 2. Prepreg control parameters
[0062] Gluing machine oven temperature: 180°C
[0063] Gluing speed: 10m / min
[0064] Resin content: 43%
[0065] Gel time: 95s
[0066] Liquidity: 22%
[0067] Volatile matter: 0.30%;
[0068] 3. Arranging boards
[0069] 4 pieces of 7628 prepreg (0.8mm board material), the copper foil is H OZ.
[0070] 4. Thermoforming
[0071] Hot pressing temperature: 190°C
[0072] Pressure: 30kg / cm 2
[0073] Hot pressing time: 60min5, basic performance parameters (Table 1)
[0074] Table 1
[0075]
Embodiment 2
[0077] 1. Mixing formula:
[0078] Phosphorus-containing epoxy resin (P: 4%) 143
[0079] Dicyandiamide 3.6
[0080] Dimethylformamide 36
[0081] Dimethylimidazole 0.060
[0082] Aluminum hydroxide 15
[0083] Silica 10
[0084] 2. Prepreg control parameters
[0085]Gluing machine oven temperature: 200°C
[0086] Gluing speed: 17m / min
[0087] Resin content: 46%
[0088] Gel time: 90s
[0089] Liquidity: 22%
[0090] Volatile matter: 0.35%;
[0091] 3. Arranging boards
[0092] 8 pieces of 7628 prepreg (1.6mm board material), copper foil is 1OZ.
[0093] 4. Thermoforming
[0094] Hot pressing temperature: 200°C
[0095] Pressure: 30kg / cm 2
[0096] Hot pressing curing time: 60min
[0097] 5. Basic performance parameters (Table 2)
[0098] Table 2
[0099]
[0100]
Embodiment 3
[0102] 1. Mixing formula:
[0103] Phosphorus-containing epoxy resin (P: 3%) 133
[0104] Dicyandiamide 3.2
[0105] Dimethylformamide 34
[0106] Dimethylimidazole 0.065
[0107] Aluminum hydroxide 25
[0108] Silica 15
[0109] 2. Prepreg control parameters
[0110] Gluing machine oven temperature: 210°C
[0111] Gluing speed: 18m / min
[0112] Resin content: 43%
[0113] Gel time: 100s
[0114] Liquidity: 22%
[0115] Volatile matter: 0.30%;
[0116] 3. Arranging boards
[0117] 6 pieces of 7628 prepreg (1.2mm board material), copper foil is 2OZ.
[0118] 4. Thermoforming
[0119] Hot pressing temperature: 210°C
[0120] Pressure: 30kg / cm 2
[0121] Hot pressing time: 60min
[0122] 5. Basic performance parameters (Table 3)
[0123] table 3
[0124]
[0125] Studies have shown that in the field of flame retardants, nitrogen, phosphorus, and aluminum-based flame retardants are environmentally friendly flame retardants. For epoxy resin systems, the presen...
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