Notebook computer

A technology for notebook computers and electronic components, which is used in electrical digital data processing, instruments, digital data processing components, etc., and can solve the problems of user discomfort and high temperature on the upper surface of the casing.

Inactive Publication Date: 2010-03-03
FU ZHUN PRECISION IND SHENZHEN +1
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  • Summary
  • Abstract
  • Description
  • Claims
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AI Technical Summary

Problems solved by technology

Under the design of the ultra-thin model, the distance between the heat-generating electronic components and the heat sink in the above-mentioned cooling module and the upper and lower covers of the case is very close, so that the temperature of the case near the heat-generating electronic components and heat sink is obviously higher than other part, causing the temperature on the upper surface of the casing to be too high, which will make the user feel uncomfortable

Method used

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Embodiment Construction

[0011] See figure 1 and figure 2 , Are respectively a three-dimensional exploded view and an assembly view of an embodiment of the notebook computer of the present invention. The notebook computer includes a base plate 100, a heat dissipation device 200 on the base plate 100, and a cover plate 300 covering the base plate 100. For brevity, the display screen of the notebook computer is omitted in the figure.

[0012] Please refer to image 3 The notebook computer further includes a circuit board 110 disposed on the bottom plate 100, a heat-generating electronic component 120 disposed on the circuit board 110, a first vacuum heat insulation board 130, and a second vacuum heat insulation board 140. The bottom plate 100 and the cover plate 300 combine to form a receiving space 400. The circuit board 110, the heating electronic component 120, the first and second vacuum insulation boards 130 and 140 and the heat dissipation device 200 are accommodated in the accommodation space 400. ...

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Abstract

The invention relates to a notebook computer comprising a bottom plate, a cover plate and a heating electronic element, wherein a containing space is formed by combining the bottom plate and the coverplate. The heating electronic element is contained in the containing space, the containing space is also provided with a vacuum heat insulation plate internally, and the vacuum heat insulation plateis arranged between the cover plate and the heating electronic element. By arranging the vacuum heat insulation plate, the conditions that the temperature of a casing at the heating electronic elementobviously higher than that of other parts because heat at the heating electronic element is directly conducted to the cover plate positioned above the heating electronic element and a user feels uncomfortable are prevented.

Description

Technical field [0001] The invention relates to a portable electronic device, in particular to a notebook computer. Background technique [0002] With the continuous improvement of the power of heating electronic components, people pay more and more attention to the heat dissipation problem, especially in notebook computers. In order to efficiently remove the heat generated by the system in a limited space, the current industry mainly uses heat pipes and heat dissipation. A heat dissipation module composed of a heat sink and a fan is installed on a heat-generating electronic component such as a central processing unit (CPU), so that the heat pipe is in contact with the CPU to absorb the heat generated by it. The heat transfer path of this method is: the heat generated by the CPU is transferred to the radiator through the heat pipe, and then the air flow generated by the fan takes away the heat transferred to the radiator. [0003] However, with the rapid advancement of technology ...

Claims

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Application Information

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IPC IPC(8): G06F1/20
Inventor 陈彦志陈荣安杨志豪林恒生郑年添郑永发
Owner FU ZHUN PRECISION IND SHENZHEN
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