Double-sided circuit front and back connecting technique

Abstract

The invention discloses a double-sided circuit front and back connecting technique and a connecting structure thereof. The connecting technique comprises the following steps: firstly, lines to be connected on both sides of a circuit board are led to the near edge of the circuit board; secondly, two rows of parallel conductive materials are etched or printed at the same positions of the near edge of the circuit board on the both sides simultaneously; and then the circuit board is subjected to reflow soldering, and a conductive flat cable is used for being respectively connected with the conductive materials on the both sides of the circuit board so as to form conduction between the both sides of the circuit board. By using the connecting mode with the conductive flat cable, compared with the production technology of hole grouting such as the conventional metallized hole and the like, the invention has low requirements on process conditions, and also can be realized for the circuit boards made of common materials such as laminated paper boards simultaneously, thus guaranteeing the reliability of conductive connection between the upper layer and the lower layer of the double-sided circuit boards simultaneously when greatly reducing the use cost of the double-sided circuit boards.

Description

technical field [0001] The invention relates to the field of electronic technology, in particular to a front and back connection process of a double-sided circuit board. Background technique [0002] The cost of existing double-sided circuit boards depends on the material of the substrate, the amount of copper foil used, and the complexity of the process. Double-sided circuit boards need to use specific materials and metallized holes and other perforation production processes, which are limited by process conditions. , so that the production cost is relatively high. [0003] Generally, in order to make the upper copper foil and the lower copper foil of the double-sided circuit board conductive, the circuit board is traditionally drilled through the circuit board, and then the copper is plated in the drilled hole by electroplating, and the electroplated copper in the drilled hole Make the upper and lower copper foils conductive, but there are disadvantages of slow drilling a...

AI Technical Summary

Problems solved by technology

[0002] The cost of existing double-sided circuit boards depends on the material of the substrate, the amount of copper foil used, and the complexity of the process. Double-sided circuit boards need to use specific materials and metallized holes and other perforation production processes, which are limited by process conditions. , making the production cost relatively high

[0003] Generally, in order to make the upper copper foil and the lower copper foil of the double-sided circuit board conductive, the circuit board is traditionally drilled through the circuit board, and then the copper is plated in the drilled hole by electroplating, and the electroplated copper in the drilled hole Make the upper and lower copper foils conductive, but there are disadvantages of slow drilling and plating speed and high cost; figure 1 As shown, some circuit boards 1' change the drilling into punching holes 11' through the circuit board. The temperature and humidity requirements of the material are high, and it is easy to cause the silver paste 12' to burst due to moisture during reflow soldering; when the plate is damp or heated, it is very easy to cause the hole filling material to be pulled and burst, which seriously affects the reliability of the product , and ordinary material circuit boards cannot use this process for double-sided conduction

Images