Substrate holding mechanism and substrate assembling apparatus provided with the same

Abstract

A substrate assembling apparatus (20) is provided with a supporting table (21) and a holding mechanism (22). The supporting table (21) supports a lower substrate (LW). The holding mechanism (22) is provided with a holding surface and a functional element. The holding surface holds the upper surface of an upper substrate (UW). The functional element is arranged on the holding surface and varies a holding force by the level of a voltage. The holding mechanism makes the lower surface of the upper substrate (UW) face the upper surface of the lower substrate (22) supported by the supporting table (21). Thus, the force for holding the substrate (UW) can be electrically controlled, and the configuration of the holding mechanism is simplified. Furthermore, since the holding force of the substrate(UW) can be smoothly varied, the holding mechanism can always correctly hold and release even a thin substrate.

Description

technical field [0001] The present invention relates to a substrate holding mechanism used, for example, in a liquid crystal display assembly process, and a substrate assembly device having the holding mechanism. Background technique [0002] The structure of the liquid crystal panel used in the liquid crystal display device is: a liquid crystal layer is sealed between two transparent substrates, wherein a transparent electrode film, an alignment film, a thin film transistor array or a color filter are formed on the surface of the transparent substrate Wait. Conventionally, two methods for manufacturing such a liquid crystal panel are known. The first method is to apply an adhesive on the bonding surface of one substrate, and after the substrate is bonded to another substrate, a liquid crystal layer is injected between the two substrates to form a liquid crystal panel. The second method is to apply an adhesive and a liquid crystal material on the bonding surface of one sub...

AI Technical Summary

Problems solved by technology

[0004]However, when using a mechanical clamping mechanism, there are the following problems: it makes mechanical contact with the substrate and powder appears; the structure of the mechanical clamping mechanism is relatively complicated

[0012] However, the substrate holding mechanism using the adhesive tape disclosed in the above-mentioned prior art has the following technical problem: After the substrates are bonded, the adhesive tape is used to hold the The mechanism for peeling off the upper substrate is more complicated

In addition, when the thickness of the substrate is relatively thin, the substrate may be deformed or damaged due to the stress generated when the adhesive tape is peeled off, and the substrate may not always be held or released normally.

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