Metal material, method for producing the same, and electrical electronic component using the same

A metal material, electrical conductivity technology, applied in the direction of metal material coating process, contact parts, metal layered products, etc., can solve the problems of fretting wear, reduced conduction between terminals, etc.

A metal material, electrical conductivity technology, applied in the direction of metal material coating process, contact parts, metal layered products, etc., can solve the problems of fretting wear, reduced conduction between terminals, etc.

CN101688312AInactive Publication Date: 2010-03-31FURUKAWA ELECTRIC CO LTD
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  • Metal material, method for producing the same, and electrical electronic component using the same
  • Metal material, method for producing the same, and electrical electronic component using the same
  • Metal material, method for producing the same, and electrical electronic component using the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0059]Electrolytic degreasing and pickling are performed on the conductive substrate of a copper-zinc alloy (CDA No.C26800) with a thickness of 0.3mm and a width of 180mm, and then the metal or alloy shown in the item [Surface] of Table 1 is covered by plating Formed on the substrate, each plating metal material is fabricated. Next, each of the prepared metal plating materials was subjected to a film-forming treatment using an organic compound shown in the item [Organic Film] in Table 1 to form a metal material with an organic film thickness of about 0.01 μm, and the test results of the present invention were respectively obtained. Objects 1 to 13 and test objects c1 to c7 for comparison. In addition, regarding the Sn alloy in the examples, the plating thickness was adjusted according to the stoichiometry of each alloy component (here, the atomic number ratio or the mass ratio described in the footnote of Table 1), and then the plating thickness was adjusted at 300° C.×15 minu...

Embodiment 2

[0104] Electrolytic degreasing and pickling are performed on the conductive substrate of copper-tin alloy (CDA No.C52100) with a thickness of 0.25mm and a width of 100mm, and then the metal or alloy shown in the [intermediate layer] item of Table 3 is plated Overlay was formed on this substrate with a thickness of 0.2 μm. In addition, about the material which forms 2 layers of intermediate|middle layers, each 0.1 micrometer was formed in order of 1st layer / 2nd layer, and it describes in Table 3. In addition, the metal or alloy shown in the item [Surface layer] is coated and formed on the above-mentioned intermediate layer by plating, and each plated metal material is produced. Next, each of the prepared metal plating materials was subjected to a film-forming treatment using an organic compound shown in the item [Organic Film] of Table 3 to form a metal material with an organic film thickness of about 0.01 μm, and the test results of the present invention were respectively obta...

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Abstract

Disclosed is a metal material (10) which is obtained by forming a surface layer (2) composed of tin or an alloy thereof on a conductive base (1), and further forming an organic coating film (3) made of an organic compound having an ether bonding group on the surface of the surface layer (2).

Description

technical field [0001] The present invention relates to a metal material, a method for producing the metal material, and an electric and electronic component using the metal material. Background technique [0002] For metal materials requiring electrical conductivity, iron or iron alloys and copper or copper alloys having excellent electrical conductivity have been used conventionally. However, in recent years, the use of bare iron or iron alloys, copper or copper alloys has decreased due to increased demands for improved contact characteristics, and materials obtained by applying various surface treatments to the above-mentioned substrates have been produced and are being used. . In particular, the plating material provided with a plating layer such as tin (Sn) or tin alloy on the above-mentioned conductive substrate can maintain the excellent conductivity and strength of the substrate, and has excellent electrical connectivity, corrosion resistance and weldability of the ...

Claims

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Application Information

Patent Timeline
31 Mar 2010
Publication
CN101688312A
IPC
C23C28/00; B32B15/08; C25D5/10; C25D5/12; C25D5/50; C25D7/00; H01R13/03
CPC
C25D5/50; C25D5/48; C23C28/00; H01R13/03; C23C2/28; C23C10/30; C25D7/00; C23C26/00
Inventors
小林良聪; 吉田和生