Active component array motherboard and manufacturing method thereof

Abstract

The invention discloses an active component array motherboard, which comprises a substrate, a plurality of active component arrays, a connecting circuit and a testing pad structure. The substrate is provided with a plurality of predetermined areas and a peripheral area. The active component arrays are arranged in the predetermined areas respectively; the connecting circuit is arranged on the substrate; and the testing pad structure is arranged in the peripheral area and electrically connected to the active component arrays by the connecting circuit. The testing pad structure comprises a plurality of mutually separated first metal patterns which are electrically connected. The invention also provides a manufacturing method for the active component array motherboard.

Description

technical field [0001] The present invention relates to a mother substrate and a manufacturing method thereof, and in particular to an active element array mother substrate capable of effectively reducing electrostatic discharge (Electro-Static Discharge, ESD) effects and a manufacturing method thereof. Background technique [0002] Generally speaking, a liquid crystal display panel is mainly composed of an active device array substrate, a liquid crystal layer, and a color filter substrate. In the array process (array process), multiple active device arrays are usually fabricated on the mother substrate at the same time, and a test that is electrically connected to multiple active device arrays is directly fabricated on the mother substrate in the array process at the same time. The pad structure, wherein the test pad structure is electrically connected to a plurality of active device arrays through a connecting line, for example. [0003] After the above-mentioned array pr...

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Problems solved by technology

[0004] However, in the above-mentioned array manufacturing process, the electrode pad area of ​​the test pad structure is often too large, and it is easy to be damaged in each manufacturing process step, such as the ion environment process of reactive ion etching (Reactive Ion Etching, RIE). , accumulate a large amount of charges on the electrode pads, so that the excessive charges will be introduced into the active device array due to the electrostatic discharge effect (ESD Effect), which will damage the lines or components in the active device array

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