Hot-pressing heads and hot-pressing device consisting of same
A technology of hot pressing device and hot pressing head, which is applied in the manufacture of electrical components, circuits, semiconductors/solid-state devices, etc. It can solve the problems of uneven hot pressing pressure of the hot pressing head, cumbersome pressure adjustment of the hot pressing head, etc., and achieve pressure regulation The process is simple and convenient, easy to detect and control, and the effect of maintaining a balanced output pressure
Active Publication Date: 2010-04-21
GUANGDONG SYGOLE INTELLIGENT TECH CO LTD
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Problems solved by technology
[0007] The invention provides a hot pressing head and a hot pressing device composed of it, which solves the problem of cumbersome pressure adjustment of the existing hot pressing head and conveniently adjusts the hot pressing pressure; Not enough balance
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[0032] Such as figure 1 , figure 2 As shown, the embodiment of the thermal head 10 of the present invention includes a mounting assembly 11 , a cylinder 12 , a bearing assembly, a heating assembly 16 and several cable management clips 17 .
[0033] The mounting assembly 11 is installed on the cylinder block 121 at one end of the cylinder 12, and the heating assembly 16 is connected to the piston rod 122 at the other end of the cylinder 12 through a bearing assembly;
[0034] The cylinder 12 includes a cylinder body 121 and a piston rod 122, the piston rod 122 can slide back and forth relative to the cylinder body 121, the upper and lower ends of the cylinder body 121 are provided with mounting threaded holes, and the end of the piston rod 122 is provided with a threaded hole;
[0035] The bearing assembly includes a bearing seat 131, a blocking piece 132, a linear bearing 133, a slide rod 15 and a stopper 14. The bearing seat 131 is mounted on the cylinder body 121 of the cy...
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The invention relates to hot-pressing heads and a hot-pressing device consisting of the same, which belong to hot-pressing heads and a hot-pressing device. The hot-pressing heads and the hot-pressing device solve the problems of complicated pressure adjustment of the traditional hot-pressing heads and unbalanced pressure of the hot-pressing heads of the traditional hot-pressing device. In the hot-pressing heads, piston cylinders are arranged between a heating component and an installation component; and the heating component performs reciprocating motion relative to the installation component through the piston cylinders. The hot-pressing device consisting of the hot-pressing heads comprises a chassis, a first pressing plate, a second pressing plate, a first reciprocator and the hot-pressing heads, wherein the piston cylinders of the hot-pressing heads are connected with a pressure control system in parallel; and the pressure control system controls the pressure difference at both ends of pistons of the piston cylinders. The output pressure of the hot-pressing heads is controlled by regulated the pressure of working fluid in the piston cylinders, and the process of the regulating the pressure is convenient to control; and the pressure control system performs the multichannel control of the hot-pressing heads of the hot-pressing device to regulate the output pressure of the hot-pressing heads uniformly so as to prevent the hot-pressing heads from being regulated one by one, and the hot-pressing heads and the hot-pressing device is suitable to be used in the process of encapsulating electronic chips.
Description
technical field [0001] The invention belongs to a thermal pressing head and a thermal pressing device, in particular to a thermal pressing head used in the packaging process of an electronic chip and a multi-channel control thermal pressing device composed of the thermal pressing head. Background technique [0002] Anisotropically conductive adhesive (ACA, Anisotropically conductive adhesive) is an adhesive material used for electronic chip packaging, mainly used in the manufacture of mobile electronic devices, consumer electronics products and radio frequency identification (RFID, Radio Frequency Identification) smart cards. ACA is mainly composed of matrix and conductive particles. During the curing process of ACA, the curing temperature, pressure and time have an important impact on the mechanical and electrical properties of the chip interconnection. [0003] Radio frequency identification (RFID) label manufacturing is a typical application of ACA, generally including th...
Claims
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IPC IPC(8): H01L21/603
Inventor 尹周平陈显才孙虎王瑜辉熊有伦
Owner GUANGDONG SYGOLE INTELLIGENT TECH CO LTD
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