Inorganic adhesive used in field of computers and preparation method thereof

An inorganic binder and computer technology, applied in the computer field, can solve the problems of concealed toxicity, slow lead poisoning, and greater health hazards, and achieve the effects of wide application range, wide performance adjustment range, and good sealing performance.

Inactive Publication Date: 2012-01-25
HENAN UNIV OF URBAN CONSTR
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing low-melting glass for electronic paste contains a large amount of heavy metal lead. Lead is one of the six metals used by humans at the earliest. It is harmful to human health and can accumulate in the body to cause lead poisoning. The role of lead poisoning Rather slow and stealthy, it is not easy to detect until the toxicity is manifested

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0057] 1. The raw material composition is by weight percentage:

[0058] SiO 2 28%, Al 2 o 3 12%, MgO 21%, B 2 o 3 12%, BaO 13%, ZnO 3%, V 2 o 5 4%, SrO 2%, Li 2 O is 3.5%, Sb 2 o 3 1%, Co 3 o 4 0.5%.

[0059] 2. Preparation method:

[0060] (1) take each raw material according to the weight percentage of each component;

[0061] (2) Fully mix the raw materials taken;

[0062] (3) Put the mixed mixture into a crucible, then put it into an electric furnace with a furnace temperature of 1400° C., keep it warm for 4 hours, stir once every 1 hour during the heat preservation stage, and stir for 5 minutes each time;

[0063] (4) Pour the melted glass liquid into a tablet press and press into thin slices or pour into cold water to quench;

[0064] (5) Put flake or granular glass into a ball mill for ball milling;

[0065] (6) Sieve, test and pack the ball-milled glass powder.

[0066] 3. Test results:

[0067] Expansion coefficient: 88.5×10 -7 / °C(300°C)

[0068]...

Embodiment 2

[0071] 1. The raw material composition is by weight percentage:

[0072] SiO 2 21%, Al 2 o 3 17%, MgO is 26%, B 2 o 3 18%, BaO 9%, ZnO 2%, V 2 o 5 3%, SrO 1%, Li 2 O is 2%, Sb 2 o 3 0.7%, Co 3 o 4 0.3%.

[0073] 2. Preparation method:

[0074] (1) take each raw material according to the weight percentage of each component;

[0075] (2) Fully mix the raw materials taken;

[0076] (3) Put the mixed mixture into a crucible, then put it into an electric furnace with a furnace temperature of 1350° C., keep it warm for 3 hours, stir once every 1 hour during the heat preservation stage, and stir for 5 minutes each time;

[0077] (4) Pour the melted glass liquid into a tablet press and press into thin slices or pour into cold water to quench;

[0078] (5) Put flake or granular glass into a ball mill for ball milling;

[0079] (6) Sieve, test and pack the ball-milled glass powder.

[0080] 3. Test results:

[0081] Expansion coefficient: 90.4×10 -7 / °C(300°C)

[008...

Embodiment 3

[0085] 1. The raw material composition is by weight percentage:

[0086] SiO 2 31%, Al 2 o 3 16%, MgO is 22%, B 2 o 3 9%, BaO 13%, ZnO 2%, V 2 o 5 2%, SrO 3%, Li 2 O is 2%, Sb 2 o 3 0.6%, Co 3 o 4 0.4%.

[0087] 2. Preparation method:

[0088] (1) take each raw material according to the weight percentage of each component;

[0089] (2) Fully mix the raw materials taken;

[0090] (3) Put the mixed mixture into a crucible, then put it into an electric furnace with a furnace temperature of 1400° C., keep it warm for 3 hours, stir once every 1 hour during the heat preservation stage, and stir for 5 minutes each time;

[0091] (4) Pour the melted glass liquid into a tablet press and press into thin slices or pour into cold water to quench;

[0092] (5) Put flake or granular glass into a ball mill for ball milling;

[0093] (6) Sieve, test and pack the ball-milled glass powder.

[0094] 3. Test results:

[0095] Expansion coefficient: 87.0×10 -7 / °C(300°C)

[009...

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PUM

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Abstract

The invention relates to an inorganic adhesive used in the field of computer and a preparation method thereof. The inorganic adhesive comprises the following raw materials, by weight percent: 20-40% of SiO2, 5-20% of Al2O3, 5-30% of MgO, 1-20% of B2O3, 1-20% of BaO, 1-10% of ZnO, 1-10% of V2O5, 0.1-5% of SrO, 0.1-5% of Li2O, 0.1-2% of Sb2O3 and 0.1-1% of Co3O4; the preparation process comprises the following steps: weighing, material mixing, melting, tabletting, ball milling and sieving; and the invention has the characteristics of complete elimination of gas, good airtightness and strong bonding force.

Description

【Technical field】 [0001] The invention belongs to the technical field of computers, and in particular relates to an inorganic binder used in the computer field and a preparation method thereof. 【Background technique】 [0002] Conductive paste is a new type of electronic functional material, which is widely used in the electronic industry. The conductive paste with carbon as the conductive filler is mainly used to make printed resistors on the wiring board of printed circuit boards, printed resistors mixed with thick films, and keyboard switches. There is a big gap between my country's conductive paste and foreign countries, mainly due to the lack of varieties and low output, and no compatible serialized products have been formed. At present, my country has a relatively high level of research and development of conductive pastes that can be commercialized. Due to the differences in performance and process properties such as sintering temperature and curing time, their wide a...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J1/00
Inventor 刘荣辉邵国金张玉花薛冰陈红军邰俊卿
Owner HENAN UNIV OF URBAN CONSTR
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