Super-wide antenna encapsulating device

Abstract

The invention discloses a super-wide antenna encapsulating device which comprises a metal reflecting plate, two lower shields, two upper shields, an interconnecting piece, a connecting strip and a pair of edge connecting pieces, wherein the two lower shields are positioned below the metal reflecting plate, the two upper shields are positioned above the metal reflecting plate, the section of each upper shield is approximately U-shaped, and each upper shield is provided with a flat plate side and two upright sides; two side-mounted grooves are arranged at the upper parts of both sides of the cross section of the interconnecting piece, the two side-mounted grooves are respectively are in plug-in mounting with side-mounted ribs arranged on the inner walls of the two upright sides belonging tothe two adjacent upper shields, two downwards extended auricular grooves are arranged at the lower parts, and the auricular grooves are respectively are in plug-in mounting with two upright hooked rabbets belonging to the inner sides of the two adjacent lower shields; the connecting strip is positioned above the interconnecting piece and installed on the two adjacent upper shields; and each edge connecting piece is installed at the outer side of one edge connecting piece and the upright side of the upper shield at the same side. The super-wide antenna encapsulating device has simple structureand convenient installation and disassembly, fully considers the enhancement of mechanical strength, and further achieves more scientific product design while ensuring cost saving.

Description

【Technical field】 [0001] The invention relates to the field of mobile communication base station antennas, in particular to an ultra-wide antenna packaging device. 【Background technique】 [0002] Panel antennas are widely used in the field of mobile communications. The following takes the smart antenna of TD-SCDMA system as an example to illustrate some shortcomings of panel antennas. [0003] As one of the third generation mobile communication (3G) systems, TD-SCDMA has broad application prospects. As one of the key technologies of the TD-SCDMA system, the planar smart antenna has become a research hotspot in the antenna industry. In the TD-SCDMA system, the system performance can be improved by using the smart antenna. In a nutshell, smart antennas can increase coverage distance, reduce initial infrastructure costs, improve link performance, and increase system capacity. [0004] At present, the realization method of the smart antenna is to design several sub-arrays sid...

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Problems solved by technology

[0005] In the prior art, the fixed sub-array is fastened with screws and nuts. This method is cumbersome, resulting in low production efficiency due to time-consuming, and due to the process, time-consuming, and many accessories, etc., it is also at the same time lead to higher cost

[0006] In addition, the current packaging method of the smart antenna is to use the overall package of the FRP radome. The biggest disadvantage of this packaging method is that the production consistency of the FRP radome is not good, resulting in a large difference in the consistency of each pair of antennas. Basically, each pair of antennas Independent debugging is required, which directly leads to low production efficiency of smart antennas, and even so, the consistency of each antenna may not be guaranteed

[0007] In addition, in the CN 101068054 patent application published on November 7, 2007, a flat-panel antenna and its packaging device and packaging device are proposed, which uses a large number of insertion ribs and insertion grooves to cooperate with each other to realize an antenna packaging device , to a certain extent, is more advanced than the previous antenna packaging technology, but it is further found in practice that it is still difficult to ideal, mainly in that as the number of antenna columns increases, the assembly parts are more and the assembly steps are more cumbersome, etc., Moreover, the increase in accessories also leads to an increase in cost, which is not suitable for the application of ultra-wide array antennas

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