Scrap remover of film sticking machine

Abstract

The invention provides a scrap remover of a film sticking machine, which comprises a first electrode, a second electrode and a DC power source, wherein the first electrode is positioned in a rotating vacuum sucking drum of the film sticking machine; the second electrode is positioned on a guide rail of a cutting blade of the film sticking machine, and the polarity of the second electrode is opposite to the polarity of the first electrode; and the DC power source is used for supplying power for the first electrode and the second electrode. In the invention, the positive electrode and the negative electrode are formed, and an electrostatic attraction method is used, so that the scraps produced by cutting can be adsorbed on the electrodes and can not be attached to the substrate but pressed under the film in the process of film sticking, thereby solving the problems in the existing technology that the splattering scraps produced in the process of cutting the DFR film for shielding fall on the substrate and are pressed under the DFR film due to different material properties of the DFR film, and the scraps witness large defects after being exposed to light.

Description

technical field [0001] The invention relates to the field of plasma display screens, in particular to a chip removal device for a film laminating machine. Background technique [0002] At present, the production of PDP (Plasma Display Panel, plasma display screen) barrier mainly includes sticking photosensitive film, exposure, development, sandblasting and direct exposure of photosensitive barrier material wet etching. In the former method, the photosensitive film contains fiber material to increase the strength, so as to protect the undeveloped barrier material in the sandblasting of the subsequent process. This feature determines that the material will have somewhat anisotropic stress distribution during cutting, resulting in the detachment of fine chips. In the film lamination process of the existing film laminating machine, the substrate has not yet fully entered the laminating area when the film is cut, so if the fine particles of the barrier material fall, they will a...

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a chip removal device for a film laminating machine, which can solve the problem that in the prior art, due to the different material properties of the DFR film used for shielding, the fine chips splashed after cutting will fall on the substrate, and then be pressed under the DFR film. The problem of chips forming larger defects after exposure

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