Marking method of material strips and compact type full-automatic IC (integrated circuit) material strip laser marking machine

Abstract

The invention discloses a marking method of material strips and a compact type full-automatic IC (integrated circuit) material strip laser marking machine. The marking machine comprises a mounting table panel, double runner material boat and material strip conveying devices, a material strip lifting device, a material strip descending device, a rejected product box, a material grabbing and discharging device, a direction detection device, a laser marking mechanism and an electrical control system, wherein the double runner material boat and material strip conveying devices are arranged on the mounting table panel; the material strip lifting device and the material strip descending device are respectively arranged at both sides of the double runner material boat and material strip conveying devices; the rejected product box arranged outside the material strip descending device; the material grabbing and discharging device is spanned right above the double runner material boat and material strip conveying devices, the material strip lifting device, the material strip descending device and the rejected product box; the direction detection device is arranged above the double runner material boat and material strip conveying devices; the laser marking mechanism is arranged above the tail end of the double runner material boat and material strip conveying devices, and a laser marking head of the laser marking mechanism can swing left and right to the right upper side of the first runner material boat and material strip conveying device or the second runner material boat and material strip conveying device to mark; and the electrical control system controls the units to coordinate and act. The compact type full-automatic IC material strip laser marking machine has the characteristics of compact structure and high working efficiency.

Description

technical field [0001] The invention relates to a marking method for IC material strips and a fully automatic IC material strip laser marking machine capable of realizing the method. More precisely, it relates to a compact marking method and a compact fully automatic IC material strip laser marking machine. marking machine. Background technique [0002] Laser marking machines are widely used in the surface marking of integrated circuits in the IC industry. According to different usage requirements, integrated circuit boards used in the IC industry have three forms: strips, chips and wafers; among them, strips are sheets composed of several chips. When marking each chip, Automatic marking is realized directly through the conveying material strip; the chip is a small granular material, which is placed in the track tray when marking, and the automatic marking is realized through the conveying track tray; the wafer is made directly on it A thin wafer with multiple (grain) chip...

AI Technical Summary

Problems solved by technology

[0005] One purpose of the present invention is to propose a method for IC material bar marking with high efficiency and compact process in view of the problems existing in the existing IC material bar laser marking machine

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