Method and system for monitoring and identifying ultrasonic bonding quality in package and interconnection of chips on line
A technology of ultrasonic bonding and chip packaging, which is used in the analysis of solids using sonic/ultrasonic/infrasonic waves, processing the response signal of detection, etc.
Inactive Publication Date: 2011-06-01
CENT SOUTH UNIV
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Problems solved by technology
Although these methods can detect bonding failures, the sensors embedded in the piezoelectric stack seriously affect the performance of the transducer and have not been applied in actual production
There are also some methods of judging the bonding quality by measuring the deformation of the lead wire and the vibration of the transducer, etc., which are difficult to apply to actual production because of the need to increase the measurement equipment that is several times more valuable than the bonding equipment
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Embodiment 1
[0077] Taking the WS3000 type thick aluminum wire ultrasonic wire bonding machine as a platform, the specific implementation process of the present invention is as follows:
[0078] Firstly, a multi-channel high-speed data acquisition system for on-line monitoring of ultrasonic bonding quality was constructed, which realized the synchronous acquisition of transducer driving voltage and current signals during the bonding process. The system consists of PCI high-speed data acquisition card, acquisition software and signal sensing circuit. Signal sensing circuits such as figure 2 shown. The acquisition signal is the current passing through the transducer piezoelectric ceramic and the voltage at its two ends. The derived voltage is U2, and the current is sampled and converted into a voltage U1 through a 9-ohm resistor. Since the input impedance of the acquisition system is very high, the resistance value of the current sampling resistor It is very small, so the connection of th...
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The invention discloses an online monitoring and identifying method and an online monitoring and identifying system for ultrasonic bonding quality in package and interconnection of chips. The method and the system analyze drive current signals of a transducer in a bonding process and extract the characteristics of the drive current signals, then send the extracted characteristic quantity into a neural network-based identifier to output an output value which indicates whether bonding is successful or not so as to judge whether the present bonding is successful or not in real time and provide aremedial chance or mark for unsuccessful bonding. Therefore, the method and the system improve the production efficiency and reliability of the package and interconnection of the chips and greatly save the cost of the package of the chips.
Description
technical field [0001] The invention belongs to the field of ultrasonic bonding in chip packaging and interconnection, and relates to an online monitoring and discrimination method and system for ultrasonic bonding quality in chip packaging and interconnection. Background technique [0002] Ultrasonic bonding is widely used in the interconnection of microelectronic packaging. It uses the ultrasonic vibration generated by the transducer to act on the bonding wire (ball) and the pad to realize the metal bond between the wire (ball) and the pad. combined method. At present, more than 90% of microelectronic package interconnections are realized by ultrasonic wire bonding technology, and offline sampling inspection is used for the inspection of bonding quality. This method has poor timeliness. Defective products lead to a sharp drop in yield. As the cost of packaging in chip manufacturing gradually increases (currently close to 80%), the bonding speed increases (15~20 lines / sec...
Claims
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IPC IPC(8): G01N29/48G01N29/12G01N29/44
Inventor 王福亮刘少华
Owner CENT SOUTH UNIV