Method for manufacturing micromodule

Abstract

The invention discloses a method for manufacturing a micromodule, which comprises the following steps: molding a material with a shrinkage characteristic to manufacture a large-sized module; performing hyperthermic treatment and cooling on the large-sized module to generate shrinkage so as to obtain a shrunk module; copying the shrunk large-sized module to obtain a mould; and molding by the mould to manufacture a module shrunk once more. In the technology, the steps of manufacturing the module, equally proportionally shrinking the material, parallelly manufacturing the mould and the like are only needed to be repeated, the process is simple and quick, and the defect that the precision, appearance freedom degree and the like of the micromodule are not easy to master in the conventional mode is improved.

Description

technical field [0001] The present invention relates to a manufacturing method of micro-components, which replaces the traditional process of making micro-components with a new type of process technology. The process technology does not need to directly produce micro-components, and it is difficult to grasp the accuracy and shape freedom of micro-components in the existing way. and other shortcomings. Background technique [0002] At present, the use of micro-components, especially micro-optical components, has been widely used in the field of lighting or integrated optics, such as micro-array lenses, etc., and in the process of such micro-optical components, there are many commonly used methods In order to utilize the photomask photoresist etching technology, due to the very small size of the components, the general molding technology cannot directly produce small-sized micro-optical components, because it is difficult to grasp the accuracy of the micro-components produced ...

AI Technical Summary

Problems solved by technology

[0002] At present, the use of micro-components, especially micro-optical components, has been widely used in the field of lighting or integrated optics, such as micro-array lenses, etc., and in the process of such micro-optical components, there are many commonly used methods In order to utilize the photomask photoresist etching technology, due to the very small size of the components, the general molding technology cannot directly produce small-sized micro-optical components, because it is difficult to grasp the accuracy of the micro-components produced by the photomask photoresist etching process , thus often resulting in manufactured microcomponents that differ from the expected results

[0003] Furthermore, the shape freedom of the micro-components produced by the photoresist etching process of the photomask is not high, so the production cost is often increased; if the structure of the components is complex and the number is large, the production process is time-consuming. Therefore, in order to improve The shortcomings of the above-mentioned existing methods, so the application for the patent of this case is proposed, so as to achieve the purpose of improving the above-mentioned deficiencies

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