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Power module without solder terminal

A power module, no welding technology, applied in the direction of electrical components, electrical solid devices, circuits, etc., can solve the problems of current path interruption, module scrapping, etc., and achieve the effect of avoiding stress fatigue

Inactive Publication Date: 2010-06-30
南京银茂微电子制造有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

After the brazing joint cracks, the current path inside and outside the module is interrupted, resulting in the scrapping of the module

Method used

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  • Power module without solder terminal
  • Power module without solder terminal
  • Power module without solder terminal

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] Such as figure 2 As shown, a power module 1 without soldering terminals includes a bottom plate 2 and a housing 3 extending upward from the periphery of the bottom plate, signal terminals 4 and power terminals; a copper-clad ceramic substrate is provided on the bottom plate in the space enclosed by the housing 3 6. Chips 7 are distributed on the copper-clad ceramic substrate 6. Three power terminal brackets 8 are arranged above the copper-clad ceramic substrate 6, and the intervals between adjacent power terminal brackets 8 are equal. The power terminal bracket 8 includes a power terminal slot 9 and a backing board 10, the backing board 10 is arranged 9 under the slot and on the copper-clad ceramic substrate 6. A support 20 for positioning the power terminal support is provided between the power terminal support 8 and the housing 3 and between the adjacent power terminal support 8. The support 20 includes a side support 11 and a bottom support 12, and the bottom support...

Embodiment 2

[0024] This embodiment is basically the same as the previous example, the difference lies in:

[0025] Such as Figure 5 , Image 6 with Figure 7 As shown, the top cover 15 includes two parts, a top plate 16 and a cover plate 17. The top plate 16 is provided with screw holes 18 for fixing power terminals. The power terminal bracket 8 is provided on the front side of the top plate 16, and the power terminal bracket 8, the support 20 and the top plate 16 combined into one. A gap 19 is left in the front of the housing 3, and pre-cut grooves 21 are provided on both sides of the gap 19 for installing the cover plate 17. Such as Figure 5 As shown, the pre-bent power terminal 5 is directly installed on the power terminal slot 9. The cover plate 17 is provided with a bent portion 23 corresponding to the notch 21 of the housing. Such as Image 6 As shown, the power module after the cover 17 is Image 6 Shown.

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PUM

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Abstract

A power module without a solder terminal comprises a head cover, a base, a signal terminal and a power terminal, wherein the base comprises a base plate and a shell upwards extending along the periphery of the base plate; a copper-clad ceramic substrate is arranged on the base plate in a space surrounded by the shell, chips are distributed on the copper-clad ceramic substrate, the head cover covers the space surrounded by the shell, a plurality of power terminal brackets are arranged on the copper-clad ceramic substrate, an equal gap is reserved between the adjacent power terminal brackets, each power terminal bracket comprises a power terminal slot and a backing plate, the packing plate is arranged below a slot and above the copper-clad ceramic substrate, and supports for positioning the power terminal brackets are arranged between the power terminal brackets and the shell as well as the adjacent power terminal brackets; and a power terminal is inserted into the power terminal slot, and the lead end of the power terminal is arranged on the backing plate and is connected with the copper-clad ceramic substrate by a thick aluminum wire with high purity.

Description

Technical field [0001] The present invention relates to a power module device, and more specifically to a power module with industrial standard installation and bus connection functions. Background technique [0002] Such as figure 1 As shown, the existing power module 10 includes a plastic housing, a bottom plate 40, signal terminals and power terminals 50. The bottom plate 40 is provided with a copper-clad DBC (direct copper bonding) substrate 30 from above, and power chips 20 are distributed on the DBC layer 30. . Take the general "62mm" power module as an example: it is usually a power module 10 with 3 power lead terminals, and the mounting holes are positioned 93mm×48mm. When used for IGBT, the voltage range is divided into 600V, 1200V and 1700V. Its maximum output current can reach 400A. When the voltage increases, the output current decreases. In terms of circuit structure, the module can be used for single tube, half bridge and chopper applications. [0003] The power ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/00H01L23/498H01L23/49
CPCH01L2924/0002
Inventor 庄伟东
Owner 南京银茂微电子制造有限公司