Positive photosensitive resin composition for spray coating, method for forming cured film using the same, cured film and semiconductor device
A technology of photosensitive resin and composition, which is applied in the manufacture of semiconductor/solid-state devices, photosensitive materials for optomechanical equipment, optics, etc., can solve the problem of non-excellent and economical positive photosensitive resin composition, Not an economical coating method etc.
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Embodiment 1
[0089] [Synthesis of alkali-soluble resin]
[0090] 4.13 g (0.016 mol) of diphenyl ether-4,4'-dicarboxylic acid and 4.32 g (0.032 mol) of 1-hydroxyl-1,2,3-benzotriazole were reacted to obtain a mixture of dicarboxylic acid derivatives (0.016 mol), the mixture (0.016 mol) of the dicarboxylic acid derivative obtained and 7.33 g (0.020 mol) of hexafluoro-2,2-bis(3-amino-4-hydroxyphenyl)propane were charged into Into a separable four-necked flask equipped with a thermometer, a stirrer, a raw material inlet, and a dry nitrogen inlet tube, 57.0 g of N-methyl-2-pyrrolidone was added and dissolved. Then, it was made to react at 75 degreeC for 12 hours using an oil bath. Next, 1.31 g (0.008 mol) of 5-norbornene-2,3-dicarboxylic anhydride (dissolved in 7 g of N-methyl-2-pyrrolidone) was added, and the mixture was further stirred for 12 hours to complete the reaction. After filtering the reaction mixture, the reaction mixture is dropped into the solution of water / methanol=3 / 1 (volume r...
Embodiment 2
[0103] The solvent of Example 1 was changed to γ-butyrolactone / ethyl acetate=45 / 55 (C-2). About the preparation method and evaluation method of the resin composition other than a solvent, it is the same as Example 1. The film thickness after development is 6.3μm, and the sensitivity is 165mJ / cm 2 , with a resolution of 3 μm.
Embodiment 3
[0105] The solvent of Example 1 was changed to γ-butyrolactone / 2-methyltetrahydrofuran=40 / 60 (C-3). About the preparation method and evaluation method of the resin composition other than a solvent, it is the same as Example 1. The film thickness after development is 6.0μm, and the sensitivity is 195mJ / cm 2 , with a resolution of 3 μm.
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