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Diode ceramic packaging template

A technology of ceramic packaging and ceramic plates, which is applied in the direction of electrical components, electric solid devices, circuits, etc., can solve the problems of short service life, non-wearable plastic templates, and decreased yield, and achieve the effect of long service life

Inactive Publication Date: 2010-08-04
苏州华菲特陶科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, graphite templates and plastic templates are used at home and abroad for the packaging templates involved in the packaging process of diodes. In production and application, the board quality of graphite templates is loose. The emergence of electronic products produces instability in production, which reduces the yield, and in the future end users, electronic drift occurs, increasing instability; plastic templates are not wear-resistant, have a short service life, and in Disadvantages such as the need for nitrogen protection in the initial stage of production

Method used

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  • Diode ceramic packaging template
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Embodiment Construction

[0021] The present invention will be described in detail below in conjunction with the accompanying drawings.

[0022] A diode ceramic packaging template includes a ceramic board body 1, screw holes 2 are opened on both sides of the ceramic board body 1, and pin positioning round holes 3 are opened in the middle of the ceramic board body 1.

[0023] Preferably, 800 pin positioning circular holes 3 are opened in the middle of the ceramic plate body 1 .

[0024] Preferably, 1000 pin positioning round holes 3 are opened in the middle of the ceramic plate body 1 .

[0025] Preferably, 1280 pin positioning circular holes 3 are opened in the middle of the ceramic plate body 1 .

[0026] Preferably, 1495 pin positioning round holes 3 are opened in the middle of the ceramic plate body 1 .

[0027] Preferably, 1500 pin positioning round holes 3 are opened on the ceramic plate body 1 .

[0028] Preferably, 2280 pin positioning round holes 3 are opened on the ceramic plate body 1 .

...

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Abstract

The invention discloses a diode ceramic packaging template which comprises a ceramic plate body, wherein both side edges of the ceramic plate body are provided with screw holes, and the middle of the ceramic plate body is provided with a pin positioning round hole. When the diode ceramic packaging template is used, dust is not generated, and the surface of the template cannot be abraded; and the aperture of the pin positioning hole cannot become large during long-term use, thus the service life of the template is long.

Description

technical field [0001] The invention relates to a diode package template, in particular to a diode ceramic package template. Background technique [0002] At present, graphite templates and plastic templates are used at home and abroad for the packaging templates involved in the packaging process of diodes. In production and application, the board quality of graphite templates is loose. The emergence of electronic products produces instability in production, which reduces the yield, and in the future end users, electronic drift occurs, increasing instability; plastic templates are not wear-resistant, have a short service life, and in The initial stage of production needs nitrogen protection and other shortcomings. Contents of the invention [0003] In order to overcome the deficiencies in the prior art, the purpose of the present invention is to provide a diode ceramic packaging template, which eliminates dust and reduces pollution during production, is easy to operate an...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/15H01L23/498
Inventor 张华锋张国强
Owner 苏州华菲特陶科技有限公司
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