Apparatus for cutting processing memory card

A technology for processing devices and memory cards, applied in the directions of transportation and packaging, conveyor objects, etc., can solve the problem of inability to process the chamfering of memory cards, and achieve the effect of reducing manufacturing costs, time required for cutting operations, and improving productivity

Active Publication Date: 2010-08-11
HANMI SEMICON CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, the traditional memory card processing device is only designed to process the outline of the memory card, but cannot p

Method used

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  • Apparatus for cutting processing memory card
  • Apparatus for cutting processing memory card
  • Apparatus for cutting processing memory card

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0025] Subsequently, a memory card processing apparatus according to an exemplary embodiment of the present invention will be described with reference to the accompanying drawings.

[0026] Reference figure 2 , The memory card processing device according to the present invention includes: a main unit 1; a memory card strip loading unit 10 located on one side of the main unit 1; a contour processing unit 20 for processing loading from the memory card The outline of the memory card on the memory card strip transferred from the unit 10; a memory card strip transfer picker 30 for transferring the memory card strip from the memory card strip loading unit 10 to the outline processing unit 20; A chamfering processing unit 40, which is used to process an oblique chamfer C on one side of the memory card transferred from the contour processing unit 20 (refer to figure 1 ); A unit picker 50, which is used to transfer the memory card whose contour processing has been completed from the conto...

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PUM

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Abstract

Disclosed is a memory card processing apparatus capable of conducting overall outline processing and chamfer processing of memory cards having a nonlinear portion by a single piece of equipment in a rapid and efficient manner. The apparatus includes a strip loading unit supplied with strips having a plurality of memory cards arranged on a frame; an outline processing unit for cutting the memory cards on the strip delivered from the strip loading unit along an outline so that the memory cards are singulated; a strip delivery picker for delivering the strip from the strip loading unit to the outline processing unit; a chamfer processing unit for processing a slanted chamfer on a lateral edge portion of the memory cards delivered from the outline processing unit; a unit picker for delivering the memory cards, outline processing of which has been completed, from the outline processing unit to the chamfer processing unit; an unloading unit for placing the memory cards, chamfer processing of which has been completed, delivered from the chamfer processing unit on a designated tray; and an unloading picker for delivering the memory cards from the chamfer processing unit to the unloading unit.

Description

technical field [0001] The invention relates to a processing device for cutting and processing a memory card in a desired shape. More particularly, the present invention relates to a memory card processing apparatus capable of quickly and efficiently performing the entire contour processing and chamfering processing of a memory card having a non-linear portion by a single device. Background technique [0002] In this technology, it is well known that memory cards are used to store data of various types of digital electronic products (including PDA (Personal Digital Assistant, personal digital assistant), digital camera, MP3 player, PMP (Portable Multimedia Player, portable multimedia player), etc. Semiconductor packaging for memory devices. [0003] Unlike conventional rectangular or square semiconductor packages, not all four sides of the memory card are rectilinear, but some of them are not. For example, a groove is formed on the side, or its corners are chamfered. [0...

Claims

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Application Information

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IPC IPC(8): H01L21/677
Inventor 郑显权罗益均
Owner HANMI SEMICON CO LTD
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