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Thin film coating system and method

A coating, thin-film technology for applications where rates are exposed to target areas that address limitations, reduced overall productivity, incomplete oxidation of sputtering systems, etc.

Inactive Publication Date: 2013-05-08
DEPOSITION SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] A limitation of prior art sputtering systems is the onset of incomplete oxidation as the average deposition rate increases
To avoid incomplete oxidation in common systems, the power supplied to the sputtering target must be limited, resulting in a reduction in the overall productivity of the system

Method used

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  • Thin film coating system and method

Examples

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Embodiment Construction

[0028] Various embodiments of the thin film coating system and method are described below with reference to the accompanying drawings, in which like elements are given like numerals to facilitate understanding of the present invention. Example thin films may include, but are not limited to: TiO 2 , rutile TiO 2 , SiO 2 , tin-doped indium oxide, Ta 2 o 5 , Nb 2 o5 , other metals and metal oxides, nitrides and carbides to form non-sputtered coatings, sputtered coatings, wear resistant coatings and combinations thereof.

[0029] In the preceding paragraphs, embodiments of the invention were viewed macroscopically in terms of sputtering target area relative to the total substrate area to be coated. Due to the rapid motion of the substrate, this macroscopic observation can be equivalent to thinly spreading the coating over a much larger area (compared to the area immediately adjacent to the sputtering target), thereby increasing the average oxidation rate and machine productiv...

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Abstract

A method and system for depositing a thin film on a substrate. In the system a target material is deposited and reacted on a substrate surface to form a substantially non- absorbing thin film. The volume of non-absorbing thin film formed per unit of time may be increased by increasing the area of the surface by a factor of "x" and increasing the rate of deposition of the target material by a factor greater than the inverse of the factor "x" to thereby increase the rate of formation of the volume of non-absorbing thin film per unit of time.

Description

[0001] related application [0002] This application is co-pending with and claims the benefit of priority from Provisional Patent Application No. 60 / 996063, filed October 26, 2007, and entitled "Thin Film Coating System and Method ", the applicant is the same as the present application, and the entire document is cited herein. [0003] This application is co-pending and a continuation-in-part of U.S. Patent Application No. 12 / 155544, filed June 5, 2008, which claims Provisional Patent Application No. 60 / 924930 (filed June 5, 2007), entitled "Low Cost High Rate Deposition Tooling," each incorporated herein by reference in its entirety. Background technique [0004] Embodiments of the invention generally involve depositing reactively sputtered films on substrates. Example films can be composed of two or more elements including, but not limited to, metal oxides, nitrides, and carbides to form non-sputtered coatings, sputtered coatings, and wear-resistant coatings. Example su...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C14/00
CPCC23C14/505C23C14/3492
Inventor N·L·博林M·雷恩斯H·R·格雷
Owner DEPOSITION SCI