Arrangement comprising at least one semiconductor component, in particular a power semiconductor component for the power control of high currents

A power control and semiconductor technology, which is applied in the field of devices having at least one semiconductor device, especially a power semiconductor device for power control of large currents, can solve the problems of unfavorable mobile applications, expensive devices, large volume, etc., and achieves compactness. structure, avoid temperature hot spots, avoid the effect of overheating problems
CN101809741AActive Publication Date: 2010-08-18SIEMENS AG
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
SIEMENS AG
Publication Date
2010-08-18

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Abstract

The description is given of an arrangement comprising at least one semiconductor component (8; 101-1, 101-2, 101-3), in particular a power semiconductor component for the power control of high currents, in which the at least one semiconductor component (8; 101-1, 101-2, 101-3) has in each case at least two electrical connection pads arranged separately from one another and is arranged on a commoncarrier body (1) in a manner electrically insulated from the latter. Furthermore a first and a second busbar (12, 13) are fixed on the carrier body (1) alongside the at least one semiconductor component (8; 101-1, 101-2, 101-3) and in a manner electrically insulated from the at least one semiconductor component (8; 101-1, 101-2, 101-3). One electrical connection pad of the at least one semiconductor component (8; 101-1, 101-2, 101-3) is electrically connected to the first busbar (12, 13) and another electrical connection pad of said semiconductor component (8; 101-1, 101-2, 101-3) is electrically connected to the second busbar (12, 13). The first and / or the second busbar (12, 13) have / has sections arranged at opposite sides of the semiconductor component (8; 101-1, 101-2, 101-3), wherein a current is applied to the connection pad electrically connected to the relevant busbar (12, 13) from both sections.
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Description

technical field

[0001] The invention relates to a device for power control of high currents having at least one semiconductor component, in particular a power semiconductor component. In this arrangement, at least one semiconductor component in each case has at least two electrical connection areas arranged separately from one another and is arranged on the common carrier body in an electrically insulated manner therefrom. The first and the second busbar are attached to the carrier body next to the at least one semiconductor component and electrically insulated from the at least one semiconductor component. An electrical connection area of ​​at least one semiconductor component is electrically connected to the first busbar. A further electrical connection area of ​​the semiconductor component is electrically connected to the second busbar. Background technique

[0002] Such a device is described in WO 03 032390 A1. Devices of the described type are used, for example, for ...

Claims

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