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Heat-peelable pressure-sensitive adhesive sheet for cutting laminated ceramic sheet and method for cut-processing laminated ceramic sheet

A pressure-sensitive adhesive sheet, a technology of a pressure-sensitive adhesive layer, applied in the direction of an adhesive method using a foaming adhesive, an adhesive method, a film/sheet-shaped adhesive, etc., capable of solving a decrease in productivity , product defects and other problems, to achieve or prevent pollution, excellent productivity, excellent thermal peeling effect

Active Publication Date: 2010-08-25
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the accuracy drops in any of these steps, the product becomes bad and the productivity drops

Method used

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  • Heat-peelable pressure-sensitive adhesive sheet for cutting laminated ceramic sheet and method for cut-processing laminated ceramic sheet
  • Heat-peelable pressure-sensitive adhesive sheet for cutting laminated ceramic sheet and method for cut-processing laminated ceramic sheet
  • Heat-peelable pressure-sensitive adhesive sheet for cutting laminated ceramic sheet and method for cut-processing laminated ceramic sheet

Examples

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Abstract

The invention relates to a heat-peelable pressure-sensitive adhesive sheet for cutting a laminated ceramic sheet and a method for cut-processing a laminated ceramic sheet. The heat-peelable pressure-sensitive adhesive sheet for cutting a laminated ceramic sheet is used for temporary fixing at cutting of the laminated ceramic sheet, and includes a base material and, formed on at least one surface of the base material, a heat-expandable pressure-sensitive adhesive layer containing a pressure-sensitive adhesive, a foaming agent and a tackifying resin, in which the heat-expandable pressure-sensitive adhesive layer has a gel fraction of 50% by weight or more, and the base polymer of the pressure-sensitive adhesive forming the heat-expandable pressure-sensitive adhesive layer has an acid value of 350mg-KOH / g or less and the tackifying resin contained in the heat-expandable pressure-sensitive adhesive layer has an acid value of 80mg-KOH / g or less.

Description

technical field The present invention relates to a heat-peelable pressure-sensitive adhesive sheet for cutting a laminated ceramic sheet and a method for cutting and processing a laminated ceramic sheet using the heat-peelable pressure-sensitive adhesive sheet. Background technique The recent demand for electronic components is miniaturization and precision of the components themselves. For example, in ceramic capacitors, typified by so-called "0603" or so-called "0402", miniaturization and high-capacity formation through high-level lamination of layers exceeding several hundred or more have become remarkable. In particular, in the field of lamination of prebaked sheets (green sheets) of ceramics such as ceramic capacitors, precision in processing is increasingly required for miniaturization and precision. For example, as an example of a method for producing a ceramic capacitor, a production method including the following steps is mentioned: (1) a step of printing electrod...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/02C09J133/00B28D1/22C09J7/22C09J7/38
CPCC09J2205/11C09J2400/123C08L33/064C09J133/08C09J7/0246C09J5/00C09J2433/00C08L33/08C09J2203/326C09J2201/606C09J2205/302C09J7/38C09J7/22Y10T156/108Y10T428/1452C09J2301/412C09J2301/502C09J2301/302C09J7/35C09J5/08C09J11/00
Inventor 柳雄一朗下川大辅有满幸生
Owner NITTO DENKO CORP
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