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Heat radiation module set

A technology of heat dissipation module and radiator, which is applied to electrical components, electric solid devices, circuits, etc., can solve the problems of small air output from fans, unsatisfactory heat dissipation effect, and inability to achieve heat dissipation effect, so as to increase the heat exchange area and heat dissipation. Exchange time, the effect of improving heat dissipation efficiency

Inactive Publication Date: 2010-10-13
YOUNG GREEN ENERGY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] When the heat dissipation module uses an axial fan, it is difficult to dissipate heat in a specific area, making the heat dissipation effect unsatisfactory
When the heat dissipation module uses a centrifugal fan, the air output of the fan is small, so the expected heat dissipation effect cannot be achieved

Method used

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  • Heat radiation module set
  • Heat radiation module set
  • Heat radiation module set

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Embodiment Construction

[0037] The aforementioned and other technical contents, features and effects of the present invention will be clearly presented in the following detailed description of a preferred embodiment with reference to the drawings. The directional terms mentioned in the following embodiments, such as "upper", "lower", "front", "rear", "left", "right", etc., are only referring to the directions of the attached drawings. Accordingly, the directional terms are used to illustrate, not to limit, the invention.

[0038] figure 1 is a schematic diagram of a heat dissipation module according to the first embodiment of the present invention. Please refer to figure 1 , the heat dissipation module 100 is suitable for dissipating heat from a heat source H, such as a light emitting diode light source. The cooling module 100 includes a first radiator 120 , a fan 130 , a partition 140 and a second radiator 150 .

[0039] The first radiator 120 is adapted to be connected to the heat source H and ...

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Abstract

The invention relates to a heat radiation module set which is applicable to radiating a heat source. The heat radiation module set comprises a first heat radiator, a fan, a second heat radiator and a partition plate. The first heat radiator is used for connecting to the heat source and is provided with an air outlet. The fan is adjacent to the first heat radiator. The second heat radiator is connected to the first heat radiator. The partition plate is arranged between the first heat radiator and the second heat radiator and is provided with an air inlet which corresponds to the fan. The airflow driven by the fan flows through the second heat radiator, the air inlet and the first heat radiator sequentially and then the airflow is exhausted from the air outlet of the first heat radiator.

Description

【Technical field】 [0001] The present invention relates to a heat dissipation module, and in particular to a heat dissipation module arranged on a heat source to assist the heat source to dissipate heat. 【Background technique】 [0002] In recent years, with the rapid development of science and technology, the operating efficiency of electronic components is getting higher and higher, which makes the heating power of various electronic components also continue to rise. In order to prevent temporary or permanent failure of electronic components due to overheating, it is very important to provide sufficient cooling performance. [0003] In order to effectively reduce the heat energy generated by electronic components during operation, heat dissipation modules can be installed on electronic components that are prone to temperature rise to quickly remove the heat energy generated by these electronic components during operation. In the prior art, there are two heat dissipation met...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/467H01L23/367H01L23/373
Inventor 许年辉吴上炫周志成
Owner YOUNG GREEN ENERGY