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LED base structure

A technology of light emitting diodes and bases, applied in the field of light emitting diode base structures, can solve the problems of inconvenience, increase the production cost of light emitting diodes, and the volume of light emitting diodes cannot be miniaturized, and achieve the effects of improving the process speed and reducing the production cost.

Inactive Publication Date: 2010-10-20
KOREA AEROSPACE INDUSTRIES
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

[0006] The above-mentioned previous proposal is to add an additional electrostatic protection component in the LED package. Although this can effectively prevent the LED chip from being damaged by static surges and overcurrent, it increases the production cost of the LED, and static electricity must be considered during the manufacturing process. Due to the size of the protective element, the overall size of the light-emitting diode cannot be miniaturized
[0007] It can be seen that the above-mentioned existing light-emitting diode base structure obviously still has inconvenience and defects in structure and use, and needs to be further improved urgently.
In order to solve the above-mentioned problems, the relevant manufacturers have tried their best to find a solution, but for a long time no suitable design has been developed, and the general product has no suitable structure to solve the above-mentioned problems. This is obviously the relevant industry. Urgent problem

Method used

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no. 1 example

[0064] figure 1 It is an exploded three-dimensional embodiment of the first heat dissipation base 10 and the first lead frame 20 of the present invention Figure 1 . figure 2 It is an exploded three-dimensional embodiment of the first heat dissipation base 10' and the first lead frame 20 of the present invention Figure II . image 3 It is a cross-sectional view of an embodiment of a light-emitting diode base structure 100 of the present invention Figure 1 . Figure 4A yes image 3 The equivalent circuit of Figure 1 . Figure 4B yes image 3 The equivalent circuit of Figure II . Figure 5 It is an exploded three-dimensional embodiment of the first heat dissipation base 10' and the first lead frame 20 of the present invention Figure three . Figure 6 It is a cross-sectional view of an embodiment of a light emitting diode base structure 100' of the present invention Figure II . Figure 7A yes Figure 6 The equivalent circuit of Figure 1 . Figure 7B yes ...

no. 2 example

[0081] Figure 8 It is an exploded three-dimensional embodiment of the second heat dissipation base 21 and the second lead frame 22 of the present invention Figure 1 . Figure 9 It is a cross-sectional view of an embodiment of a light-emitting diode base structure 200 of the present invention Figure three . Figure 10A yes Figure 9 The equivalent circuit of Figure 1 . Figure 10B yes Figure 9 The equivalent circuit of Figure II . Figure 11 It is an exploded three-dimensional embodiment of the second heat dissipation base 21 and the second lead frame 22 of the present invention Figure II . Figure 12 It is the fourth cross-sectional view of an embodiment of a light emitting diode base structure 200' of the present invention. Figure 13A yes Figure 12 The equivalent circuit of Figure 1 . Figure 13B yes Figure 12 The equivalent circuit of Figure II .

[0082] Such as Figure 8 and Figure 9 As shown, the present embodiment is an LED base structure 2...

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Abstract

The invention relates to an LED base structure which comprises a first cooling base, a first lead frame and an insulated base. The first cooling base is provided with a crystalline solid area, a first insulation layer is arranged at the outer side of the crystalline solid area and combined with the first lead frame, and the first lead frame and the first cooling base are coated by the insulated base so that the bottom surfaces of the crystalline solid area and the first cooling base are exposed outside. The first cooling base and the first lead frame are mutually insulated by the first insulation layer for substituting the use of a traditional insulation sheet, the first insulation layer can be arranged on the first cooling base in a printing mode so that the processing procedure of the LED base structure can be simplified to further achieve the efficacy of mass production.

Description

technical field [0001] The invention relates to a light-emitting diode base structure, in particular to a light-emitting diode base structure applied to high-power light-emitting diodes. Background technique [0002] Light-emitting diodes have the advantages of small size, long life, high directivity, good shock resistance, etc., and compared with fluorescent lamps, light-emitting diodes do not contain mercury and other polluting materials, so light-emitting diodes are considered highly environmentally friendly light source. Moreover, light-emitting diodes are gradually developing towards multi-color and high-brightness, so the application range of light-emitting diodes has been extended to large outdoor advertising billboards and traffic lights, etc., and gradually replace tungsten lamps and mercury lamps as a new generation of lighting sources. [0003] In the LED manufacturing process, since the lead frame and the heat dissipation base are both made of metal, insulating ...

Claims

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Application Information

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IPC IPC(8): F21V21/00F21V29/00H01L33/00F21Y101/02H01L33/64
Inventor 李永富陈明鸿詹政卫
Owner KOREA AEROSPACE INDUSTRIES