Check patentability & draft patents in minutes with Patsnap Eureka AI!

Lithographic apparatus, positioning system, and positioning method

A technology of positioning system and lithography equipment, applied in the field of positioning of lithography equipment, can solve problems such as undesired lithography equipment and the like

Inactive Publication Date: 2012-10-03
ASML NETHERLANDS BV
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the movable object is damaged, this also means an undesired downtime of the lithographic equipment in order to repair or replace the movable object and / or repair the expensive lithographic equipment

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Lithographic apparatus, positioning system, and positioning method
  • Lithographic apparatus, positioning system, and positioning method
  • Lithographic apparatus, positioning system, and positioning method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0015] figure 1 A lithographic apparatus LA according to an embodiment of the invention is schematically shown. The lithographic apparatus includes: an illumination system (illuminator) IL configured to condition a radiation beam B (e.g., ultraviolet (UV) radiation or other suitable radiation); a patterning device support structure or a mask support structure (e.g., a mask A mold table) MT configured to support a patterning device (eg mask) MA and connected to a first positioning device PM configured to precisely position the patterning device according to determined parameters. The apparatus also includes a substrate table (e.g. wafer table) WT or "substrate support structure" configured to hold a substrate (e.g. a resist-coated wafer) W and configured to A second positioner PW for precisely positioning the substrate is connected. The apparatus further comprises a projection system (e.g. a refractive projection lens system) PS configured to project a pattern imparted to the...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a lithographic apparatus, a positioning system, and a positioning method. The positioning system for a lithographic apparatus including a control system to position a moveable object of the lithographic apparatus in at least one direction which is substantially parallel to a frame, the control system including a measurement system to measure a position of the moveable object, an actuator to apply a force to the moveable object, and a controller to provide a drive signal to the actuator based on an output of the measurement system; and an emergency brake system configured to determine a failure of the control system, and if the failure is determined disable the control system and pull the moveable object against the frame.

Description

technical field [0001] The invention relates to a lithographic equipment, a positioning system for the lithographic equipment and a positioning method for the lithographic equipment. Background technique [0002] A lithographic apparatus is a machine that applies a desired pattern to a substrate, usually to a target portion of the substrate. For example, lithographic equipment may be used in the manufacture of integrated circuits (ICs). In this case, a patterning device, alternatively referred to as a mask or reticle, may be used to generate the circuit pattern to be formed on the individual layers of the IC. The pattern can be transferred onto a target portion (eg, comprising a portion, one or more dies) on a substrate (eg, a silicon wafer). Typically, the pattern is transferred via imaging to a layer of radiation sensitive material (resist) provided on the substrate. Typically, a single substrate will contain a network of successively patterned adjacent target portions....

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/20
CPCG03F7/70725
Inventor E·M·J·斯密特思
Owner ASML NETHERLANDS BV
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com