Fluid conveying device for vacuum processing system
A fluid transmission and vacuum processing technology, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the problems of high price, waste of machine space, waste of manpower and material resources, etc., achieve good RF insulation effect, save equipment space , the effect of saving manpower and material resources
Active Publication Date: 2012-04-11
ADVANCED MICRO FAB EQUIP INC CHINA
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Problems solved by technology
[0009] However, according to the prior art, the effect of radio frequency shielding is not good. This is because the shielding device is arranged below the support table of the process sheet, thus giving more space and paths for radio frequency leakage. Secondly, because the above channels are not radio frequency insulation material, which affects the RF electric field
Moreover, since the semiconductor processing machine is an expensive and precise instrument, it usually needs to be equipped with a lot of components, the above-mentioned channel and its connecting pipes occupy too much area of the process wafer support table, which will cause the machine area to be too large and consume too much power. Larger, more expensive, and a waste of manpower and material resources, polluting the environment
In addition, the setting of the shielding device also wastes machine space
Method used
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[0023] A first aspect of the present invention provides a fluid transport device for a vacuum processing system, specifically as follows.
[0024] The inventive mechanism of the present invention is to utilize a bushing comprising one or more channels for better radio frequency isolation, space saving and cost reduction.
[0025] The first aspect of the present invention provides a fluid transfer device used in a vacuum processing system, wherein the fluid transfer device includes one or more sleeves connected between the process sheet support table and the cooling device, wherein, The sleeve has a first end and an opposite second end, at which one or more channels for leading in and out fluids are provided, each of the channels is connected to the The cooling passage in the process sheet support platform communicates with the cooling device arranged under the process sheet support platform. The following will be described in conjunction with specific embodiments. In this emb...
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The invention provides a fluid conveying device for a vacuum processing system, which comprises one or a plurality of sleeve pipes, which are connected between a process sheet supporting platform and a cooling device, wherein each sleeve pipe has a first end and an opposite second end; one or a plurality of channels for leading in and out fluid are arranged at the first and second ends; and each channel is communicated with a cooling path in the process sheet supporting platform and the cooling device arranged below the process sheet supporting platform. The invention also provides a process sheet temperature control system and the vacuum processing system, which comprise the fluid conveying device respectively. The device has a better radio frequency insulation effect and saves equipmentspace.
Description
technical field [0001] The present invention relates to vacuum processing systems, and more particularly to cooling systems in plasma processing. Background technique [0002] In the semiconductor manufacturing process, various processes depend on the temperature of the process wafer to a large extent. Therefore, the temperature control of the process wafer is a very important part in the semiconductor manufacturing process, and since the process wafer has a certain size, it is even more crucial to be able to uniformly control the temperature of the process wafer. The temperature of the process sheet is determined by plasma treatment, heat radiation, heat conduction, and chemical processes occurring on the surface of the process sheet. [0003] In the prior art, a cooling channel is usually provided in the process chip table, and the coolant in the cooling channel is used to exchange heat with the process chip on the process chip table to control the temperature of the proc...
Claims
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IPC IPC(8): H01L21/00
Inventor 倪图强陈妙娟吴狄
Owner ADVANCED MICRO FAB EQUIP INC CHINA