LED packaging module capable of releasing stress

Abstract

The invention relates to the semiconductor illumination technology, in particular to an LED packaging module, comprising an LED wafer. The LED packaging module is characterized in that the LED wafer is arranged at the bottom of a cavity, the top of the cavity is provided with an opening, the opening is provided with an optical plate, the optical plate and the cavity form a closed accumulating space in which flexible glue is arranged, and the optical plate can move or deform towards the outer side of the accumulating space so as to release the thermal stress of the flexible glue.

Description

Technical field [0001] The invention relates to semiconductor lighting technology, in particular to an LED package module. Background technique [0002] Traditional LED packaging technology generally uses a lens to seal the LED chip and encapsulant to form a package module or light source. [0003] Chinese patent document CN101369614 discloses a high-power white light emitting diode packaging structure and packaging method on February 18, 2009, which mainly include LED chips, substrates, inner sealing gel, phosphor layer or phosphor gel layer, and outer sealing lens. It is characterized in that the LED chip is attached to the substrate, the chip electrode is connected to the circuit layer on the substrate, the LED chip is covered by an inner sealant, and the outer surface of the inner sealant is covered by a phosphor layer or a phosphor adhesive layer. Or the outer surface of the phosphor glue layer is covered by the outer sealing lens. [0004] Just like the structure disclosed in...

AI Technical Summary

Problems solved by technology

On the one hand, the accumulated heat will cause temperature rise, the working environment of the LED chip will deteriorate, and the light will decay prematurely. On the other hand, the internal stress of the sealant will be generated due to thermal expansion and contraction. Since the sealant is in a fully enclosed structure, The stress cannot be effectively released, and the stress will impact the gold wire, and the probability of breaking the gold wire or gold wire solder joints is greatly increased. Often, the circuit breaks when the package module has not reached its service life, and the module cannot be used intermittently.

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