Resin laminate, pressure sensitive adhesive sheet, method for working adherend using the pressure sensitive adhesive sheet, and device for separating the pressure sensitive adhesive sheet

A technology of peeling device and resin layer, applied in the direction of lamination device, synthetic resin layered product, lamination, etc., can solve the problems of sticky damage, difficult peeling, no back grinding tape has been found, and achieve the effect of smooth peeling

Inactive Publication Date: 2010-10-20
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when the present inventors selected an arbitrary material and studied the same problem, it was found that, due to the shrinkage of the shrinkable film in multiple directions, etc., the heated adhesive sheet overlapped on the surface of the semiconductor wafer, etc., and could occur. Difficult to peel off or damaged by adherends
That is, for backgrinding tapes that are unnecessary after backgrinding to protect the semiconductor wafer from breakage when backgrinding the semiconductor wafer, no tape that can be peeled off without damaging or contaminating the semiconductor wafer has yet been found. Back grinding tape, and peeling device for peeling back grinding tape without damaging and contaminating semiconductor wafers

Method used

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  • Resin laminate, pressure sensitive adhesive sheet, method for working adherend using the pressure sensitive adhesive sheet, and device for separating the pressure sensitive adhesive sheet
  • Resin laminate, pressure sensitive adhesive sheet, method for working adherend using the pressure sensitive adhesive sheet, and device for separating the pressure sensitive adhesive sheet
  • Resin laminate, pressure sensitive adhesive sheet, method for working adherend using the pressure sensitive adhesive sheet, and device for separating the pressure sensitive adhesive sheet

Examples

Experimental program
Comparison scheme
Effect test

manufacture example 1-1

[0113] 100 parts by weight of an acrylic polymer (manufactured by Daiichi Lace, trade name "Leocoat R1020S"), 10 parts by weight of a pentaerythritol-modified acrylate crosslinking agent (manufactured by Nippon Kayaku Co., Ltd., trade name "DPHA40H"), a crosslinking agent ( Mitsubishi Gas Chemical Corporation, trade name "TETRAD C") 0.25 parts by weight, crosslinking agent (NIPPONPOLYURETHANE INDUSTRY CO., LTD., trade name "CORONATE L") 2 parts by weight, active energy ray polymerization initiator (Ciba- 3 parts by weight of Geigy K.K. product, trade name "Irugacure 651") was dissolved in toluene to obtain a polymer solution 1 having a solid content concentration of 15% by weight. The obtained polymer solution 1 was coated on a polyethylene terephthalate film (manufactured by Torayindustries Inc., trade name "LUMIRRORS10", "LUMIRRORS10", etc.) as a low thermal shrinkage substrate layer using a coating machine to a thickness of 30 μm after drying. PET film with surface processi...

manufacture example 1-2

[0115] Polymer solution 1 was obtained in the same manner as in Production Example 1-1 above. The obtained polymer solution 1 was coated on a polyethylene terephthalate film (manufactured by Toray industries inc., trade name "LUMIRRORS10" as a low thermal shrinkage base layer) with a thickness of 30 μm after drying using a coater. , PET film with surface processing for printing, thickness 50μm, rigidity at 80°C 1.86×10 5 N / m) and dried to form an adhesive layer. Then, a biaxially stretched polyester film (manufactured by Toyobo Co., Ltd., trade name "SPACECLEANS 7200", thickness 30 μm, shrinkage rate [A (%) in the main shrinkage direction was laminated on the adhesive layer as a high heat shrinkage base layer. ] and the shrinkage ratio [B (%)] in the direction perpendicular to the main shrinkage direction (A:B) was 40:40), and a resin laminate 2 was obtained.

manufacture example 1-3

[0117] Acrylic polymer: 100 parts by weight of 2-ethylhexyl acrylate / acrylic acid (90 parts by weight / 10 parts by weight) copolymer, 10 parts by weight of dipentaerythritol hexaacrylate, active energy ray polymerization initiator (Ciba-Geigy K.K. (trade name "Irugacure 651"), 3 parts by weight, was dissolved in toluene to obtain a polymer solution 2 with a solid content concentration of 15% by weight. The obtained polymer solution 2 was coated on a polyethylene terephthalate film (manufactured by Toray industries inc., trade name "LUMIRRORS10" as a low thermal shrinkage base layer) with a thickness of 30 μm after drying using a coater. , PET film with surface processing for printing, thickness 38μm, rigidity at 80°C 1.41×10 5 N / m) and dried to form an adhesive layer. Then, a biaxially stretched polyester film (manufactured by Toyobo Co., Ltd., trade name "SPACECLEANS 7200", thickness 30 μm, shrinkage ratio [A (% )] and the shrinkage ratio [B (%)] in the direction perpendicul...

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Abstract

This invention provides a pressure sensitive adhesive sheet comprising a resin laminate. The resin laminate comprises a higher heat shrinkable base material layer with a relatively higher heat shrinkage and a lower heat shrinkable base material layer with a relatively lower heat shrinkage bonded to each other through an adhesive layer. The higher heat shrinkable base material layer satisfies a requirement of A : B = 1 : 1 to 10 : 1 wherein A represents the shrinkage in a main shrinkage direction, %; and B represents the shrinkage in a direction orthogonal to the main shrinkage direction, %. Upon heating from any one direction, the resin laminate is warped on the higher heat shrinkable base material layer side, and, upon further heating, the resin laminate is spontaneously wound in one direction from one end to form one cylindrical roll. Upon heating from any one direction, the pressure sensitive adhesive sheet can be separated smoothly from the adherend and thus is usable, for example, as a pressure sensitive adhesive sheet for semiconductor wafer polishing.

Description

technical field [0001] The present invention relates to a resin laminate, a pressure-sensitive adhesive sheet, a method for processing an adherend using the pressure-sensitive adhesive sheet, and a pressure-sensitive adhesive sheet peeling device, wherein the resin laminate can be heated from any one direction. Actively wound from the end to form a cylindrical wound body, the adhesive sheet is formed of a resin laminate for actively winding from the end to form a cylindrical wound body by heating from either direction as In semiconductor wafer grinding (back grinding) for peeling off the adherend from the semiconductor wafer, etc. Background technique [0002] Semiconductor wafers made of silicon, germanium, gallium-arsenic, etc. are produced in a large-diameter state, and the backside is ground to a predetermined thickness, and then backside treatment (etching, polishing, etc.) Manufacture of semiconductor chips. In recent years, expectations for thinner and lighter semic...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B27/08B29C61/06B32B7/02B32B27/00B32B27/30C09J7/02C09J133/00H01L21/301H01L21/304H01L21/683B29K105/02B29L7/00B29L9/00B32B7/028C09J7/29
CPCB32B37/12B29C63/0013H01L21/6836B32B2038/1891C09J7/0296H01L2221/68386B32B7/12B29K2995/0049H01L2221/68327H01L21/67132B32B7/02B32B2307/736C09J2201/162B29L2009/00B32B37/144B29C53/32H01L21/304B32B7/06B32B25/08B32B25/14B32B27/08B32B27/16B32B27/18B32B27/20B32B27/22B32B27/281B32B27/283B32B27/285B32B27/30B32B27/302B32B27/308B32B27/32B32B27/325B32B27/34B32B27/36B32B27/40B32B2250/24B32B2255/10B32B2255/26B32B2255/28B32B2264/02B32B2264/101B32B2270/00B32B2307/308B32B2307/50B32B2307/518B32B2307/748B32B2307/75B32B2405/00B32B2457/00C09J7/29Y10T156/1158Y10T156/1168Y10T428/2848Y10T156/1917Y10T428/24942Y10T156/1978C09J2301/162B32B7/028B32B27/06
Inventor 西尾昭德木内一之
Owner NITTO DENKO CORP
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