Main roller slotting method of multi-wire cutting machine

Abstract

The invention relates to a main roller slotting method of a multi-wire cutting machine. In the method, when each 1 unit of increase of the wearing capacity of a steel wire is measured, corresponding main roller slotting spaces are sequentially reduced by 0.5 to 1 same unit. By adopting the method of the invention, because the main roller slotting spaces are sequentially reduced, reverse compensation can be carried out for results that the steel wire is gradually changed from thick to thin and a cut gap is changed from large to small, so that a cut silicon slice is kept uniform, and the qualified rate of products is improved.

Description

technical field [0001] The invention relates to a method for slotting main rolls of a multi-wire cutting machine, which is mainly used for cutting crystal rods. Background technique [0002] At present, in the process of producing silicon wafers by multi-wire cutting crystal ingots, the steel wires used are cut back and forth in the cutting machine and used multiple times. After cutting and wear, the steel wires gradually change from thick to thin, and the cutting gap From large to small, the cut silicon wafers are thinner when cut earlier and thicker when cut later. The root cause of this phenomenon is that the main roller adopts the method of uniform grooving, that is, the distance between the grooves is consistent. Contents of the invention [0003] The object of the present invention is to provide a main roller grooving method for multi-wire cutting crystal rods that can make the thickness of the cut silicon wafers uniform. [0004] The technical solution adopted by ...

AI Technical Summary

Problems solved by technology

[0002] At present, in the process of producing silicon wafers by multi-wire cutting crystal ingots, the steel wires used are cut back and forth in the cutting machine and used multiple times. After cutting and wear, the steel wires gradually change from thick to thin, and the cutting gap From large to small, the cut silicon wafers are thinner when cut earlier and thicker when cut later