Forming method for uniformly distributing fluorescer on light-emitting diode

A light-emitting diode, uniform distribution technology, applied in electrical components, circuits, semiconductor devices, etc., can solve the problems of different quality of soft glue, waste of human resources, uneven soft glue, etc., achieve uniform brightness distribution, shorten manufacturing time, Guaranteed quality results

Inactive Publication Date: 2010-11-10
川连机械股份有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] The main purpose of the present invention is to solve the technical problems of uneven soft glue after stirring, different quality of soft glue after each stirring, and waste of human resources and time in the existing light-emitting diode molding method

Method used

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  • Forming method for uniformly distributing fluorescer on light-emitting diode
  • Forming method for uniformly distributing fluorescer on light-emitting diode
  • Forming method for uniformly distributing fluorescer on light-emitting diode

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Embodiment Construction

[0023] The above and other features and advantages of the present invention will be described in detail below with reference to the accompanying drawings.

[0024] see figure 2 As shown, the main purpose of the present invention provides a molding method for uniformly distributing fluorescent agent in light-emitting diodes, which includes the following steps:

[0025] Material preparation step 1: In the material preparation step 1, the first liquid glue 11, the second liquid glue 12, and the fluorescent material liquid glue 13 are prepared, wherein the first liquid glue 11 is made of silicone resin (silicon resin) material, and the second liquid glue The second liquid glue 12 is a liquid glue made of silicone rubber. Through the material preparation step 1, the first liquid glue 11, the second liquid glue 12, and the fluorescent (fluorescent) material liquid glue 13 are respectively prepared, and they can be separated according to requirements. adjusting the concentration ra...

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Abstract

The invention provides a forming method for uniformly distributing a fluorescer on light-emitting diode (LED), comprising the following steps: a materials-preparing step, i.e. preparing a first liquid glue, a second liquid glue and a fluorescent material liquid glue; a dynamic stirring step, i.e. transmitting the first liquid glue, the second liquid glue and the fluorescent material liquid glue together prepared in the materials-preparing step to a dynamic mixing and stirring device for carrying out dynamic stirring so as to form a uniform liquid fluorescer; and an ejection forming step, i.e. ejecting the uniform liquid fluorescer obtained in the dynamic stirring step into the base of the LED of a mould and forming. By adopting the steps of the method in the invention, the fluorescer can be distributed uniformly in the base of the LED of the mould, brightness which is projected outwards by each batch of LED crystals is distributed uniformly, and the quality of each batch of finished products can be ensured, thereby further greatly improving the good rate of the products, saving human resource and greatly shortening manufacturing time.

Description

technical field [0001] The invention relates to a molding method of a light-emitting diode, in particular to a molding method for uniformly distributing fluorescent agents in the light-emitting diode. Background technique [0002] Chinese Taiwan patent certificate No. I237409 discloses a kind of " LED production method ", please refer to figure 1 As shown, the soft glue 85 is used to cover the diode crystal 83 and the metal wire 84 in the carrier 81 and the protective body 82 by dispensing glue, so that the soft glue 85 can absorb the electricity produced by the diode crystal 83. Thermal power, thus the effect of protecting the diode crystal 83 can be achieved; [0003] Although the "LED manufacturing method" can achieve the effect of protecting the diode crystal 83, because the soft glue 85 is artificially stirred and then placed, often the strength of the artificial stirring is different each time, resulting in soft glue 85 after stirring. Uniform soft glue 85 cannot be ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/00
Inventor 潘武川
Owner 川连机械股份有限公司
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