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Optical back plate interconnection system and communication equipment

An interconnection system and optical backplane technology, which is applied in the field of optical backplane interconnection systems and communication equipment, can solve problems such as signal transmission quality degradation, long optical links, and large optical signal loss, so as to reduce loss, improve transmission quality, The effect of shortening the optical link

Active Publication Date: 2010-11-10
HUAWEI TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the process of realizing the present invention, the inventors found that the signal loss of the optical waveguide itself is relatively large, and the optical link in this solution is relatively long, resulting in a greater loss of optical signals and a decrease in signal transmission quality

Method used

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  • Optical back plate interconnection system and communication equipment
  • Optical back plate interconnection system and communication equipment
  • Optical back plate interconnection system and communication equipment

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Embodiment Construction

[0019] In order for those skilled in the art to further understand the characteristics and technical content of the embodiments of the present invention, please refer to the following detailed description and drawings related to the embodiments of the present invention. The drawings are only for reference and description, and are not intended to limit the embodiments of the present invention. .

[0020] In the prior art, the processing technology similar to the existing PCB (Printed Circuit Board) is used to process multi-layer polymer waveguides, so that the optical backplane interconnection system has better processing performance and avoids the existence of high-density optical fiber backplanes. Physical implementation complexity issues. However, since the optical waveguide itself has a large signal loss, and the optical link in the prior art is relatively long, the optical signal loss is greater, and the signal transmission quality is degraded. Based on this, the embodime...

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Abstract

The embodiment of the invention provides an optical back plate interconnection system and communication equipment. The optical back plate interconnection system comprises a back plate, a front insertion plate, a rear insertion plate and a connector; the front insertion plate and the rear insertion plate are respectively arranged at the two side of the back plate, are orthotropic with each other and are both provided with an optical waveguide channel; and the optical waveguide channels are butted through the connector connected on the back plate to form a light path passed through by optical signals for realize optical signal transmission. In the embodiment of the invention, the front insertion plate and the rear insertion plate are respectively arranged at the two sides of the back plate and are arranged orthotropically with each other and the optical waveguide channels in the front insertion plate and the rear insertion plate are butted directly through the connector to form the light path, thereby realizing the optical signal transmission, shortening an optical link and reducing the loss of the optical signals. In addition, since the optical waveguide channels are adopted, the system can achieve better processing performance and reduces the complexity of the physical implementation of a high-density optical fiber back plate.

Description

technical field [0001] The invention relates to the technical field of communication equipment, in particular to an optical backplane interconnection system and communication equipment. Background technique [0002] In the communication system, as the signal rate continues to increase, the access capacity of the equipment becomes larger and larger, and the system bandwidth increases accordingly. Among them, increasing the number of buses is one of the ways to increase the system bandwidth, but due to the limitations of chip technology, process technology, heat dissipation, etc., the realization of large-capacity electrical interconnection systems is becoming more and more difficult, and optical interconnection due to low loss , low crosstalk, high density, and channel characteristics have nothing to do with the rate and other advantages, the optical backplane interconnection system becomes a better solution. [0003] The optical backplane interconnection system used in the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04B10/00G02B6/42H04B10/80
CPCG02B6/43G02B6/3885G02B6/3608H05K1/0274H04B10/801H05K2201/044
Inventor 贾功贤刘炜霞汪泽文
Owner HUAWEI TECH CO LTD
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