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Method and device for supplying electrical power

A power supply device and electric power technology, applied in the direction of current conduction device, contact device, electrode, etc., can solve the problem of chip fragility

Inactive Publication Date: 2010-11-10
RENEWABLE ENERGY CORP LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

These wafers are fragile and must be handled with great care to avoid breakage

Method used

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  • Method and device for supplying electrical power
  • Method and device for supplying electrical power
  • Method and device for supplying electrical power

Examples

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Embodiment Construction

[0014] exist figure 1 In , a device is shown comprising a delivery device 10 positioned above a liquid container 2 containing a liquid. The conveyor 10 includes a wafer carrier 12 mounted between two conveyor belts 14a and 14b.

[0015] The transfer device further comprises a drive system (not shown) for moving the conveyor belt, and thus also the wafer carrier 12 above the liquid container 2, as indicated by arrow A.

[0016] At the first end of container 2 ( figure 1 Near the middle left side), pick up the wafer 3, or otherwise fix the wafer 3 to the wafer carrier 12, and transfer it to the second side of the container 2 ( figure 1 The wafer 3 is clamped by the transfer device 10 during the right side in ), released at said second side of the container 2, and transferred, for example, to the next sub-processing tool. During transfer, the wafer 3 is fully or partially submerged in the liquid.

[0017] figure 1 In , three wafers 3 are shown being transported in parallel. ...

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PUM

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Abstract

Method and device for supplying electrical power to a wafer that is at least partially submerged in a liquid. The device comprises : - a container filled with the liquid; - a transportation device comprising a wafer carrier device for transporting the wafer at least partially submerged through the liquid; - a power supply device for supplying electrical power to the wafer.

Description

technical field [0001] The present invention relates to a method and apparatus for supplying power to a wafer. More particularly, the present invention relates to a method and apparatus for supplying electrical power to a wafer at least partially submerged in a liquid. Background technique [0002] Apparatus and methods for exposing wafers to liquids are described in United Kingdom (GB) Patent Application 0709619.1, filed 18 May 2007, which application is incorporated herein by reference. [0003] In some processes, it is desirable to provide power to the wafer while the wafer is at least partially submerged in the liquid. An example of such a process is electroplating, where, for example, Ni, Cu, Sn and / or Ag are applied to the wafer. One difficulty with this process is to provide electrical contact to the wafer without applying strong forces to the wafer that could cause damage to the wafer. mechanical force. Another disadvantage in the above process is that metal or ot...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D17/00C25D17/06C25D17/14C25D17/28H01L21/00H01L21/288H05K3/18C25D7/12
CPCC25D7/12C25D17/28H01L21/6776H01L21/67706H01L21/67005C25D17/005C25D17/14C25D17/06C25D17/00C25D17/001C25D17/007H01L21/2885
Inventor 埃里克·萨乌尔卡尔·伊娃·伦达尔罗博图斯·安东纽斯·斯蒂曼
Owner RENEWABLE ENERGY CORP LTD