Conductor structure for packaging and routing semiconductor and combination structure thereof
A technology that combines structure and semiconductor, applied in semiconductor/solid-state device manufacturing, semiconductor devices, semiconductor/solid-state device components, etc., can solve problems that affect the quality of wire bonding and the controllability of wire bonding process
Inactive Publication Date: 2012-07-04
ASE ASSEMBLY & TEST SHANGHAI
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Problems solved by technology
As a result, it is difficult to control the wire bonding process so that the solder ball bonding structure of the first joint has a uniform bonding reliability performance, thus affecting the wire bonding quality and the controllability of the wire bonding process
Method used
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[0027] In order to make the above-mentioned purposes, features and advantages of the present invention more obvious and understandable, the preferred embodiments of the present invention will be specifically cited below, together with the accompanying drawings, for a detailed description as follows:
[0028] Please refer to figure 2 As shown, it discloses a cross-sectional view of a wire structure for bonding a semiconductor package according to the first embodiment of the present invention. A wire structure 40 of the present invention includes a wire core material 41 and a homogeneous coating coated on its outer surface. 42. The material of the homogeneous coating layer 42 is the same as that of the wire core material 41, and the grain size (grain size) of the homogeneous coating layer 42 of the present invention is smaller than that of the wire core material 41 of grain size.
[0029] Such as figure 2 As shown, in the first embodiment of the present invention, the materi...
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The invention discloses a conductor structure for packaging and routing semiconductor and a combination structure thereof. The conductor structure is used for semiconductor packaging and routing technology and comprises conductor core material and a homogeneous cladding layer which covers the external surface of the conductor core material, wherein the grain of the homogeneous cladding layer is small so as to enhance the surface hardness and the tension strength of the conductor structure. When the homogeneous cladding layer combines with the second routing conductor, a contacting surface microstructure is formed between the homogeneous cladding layer on the surface of the conductor structure and a routing combination surface and can provide anchoring and adhering function to further enhance the adhesive strength of the conductor structure and the routing combination surface. Therefore, the conductor routing bond strength and the tension strength equal to the conductor structure can be achieved, and the cost of cladding layer material can be further reduced.
Description
【Technical field】 [0001] The present invention relates to a wire structure and its combined structure for semiconductor packaging wire bonding, in particular to a wire core material coated with a homogeneous coating in the semiconductor packaging wire bonding process, and the grain size of the homogeneous coating is less than 1 Wire structure and bonding structure for micron semiconductor package bonding. 【Background technique】 [0002] In the manufacturing process of the existing semiconductor package structure, wire bonding technology has been widely used in the electrical connection between the semiconductor chip and the package substrate or lead frame. Take the electrical connection between the semiconductor chip and the lead frame as an example. The purpose is to use very thin wires (less than 50 microns) to connect the contacts on the chip to the inner pins on the lead frame, and then transmit the circuit signal of the chip to the outside world. After the lead frame ...
Claims
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IPC IPC(8): H01L23/49H01L21/603
CPCH01L2224/48624H01L2224/45124H01L2224/05624H01L24/78H01L2224/48724H01L2224/4851H01L2224/32245H01L2224/48699H01L24/85H01L2924/01029H01L2224/48091H01L2924/01013H01L2224/45147H01L2224/92247H01L2224/78301H01L2224/48599H01L2924/01047H01L2924/01079H01L2224/48465H01L2224/45139H01L2224/45565H01L2224/48247H01L24/45H01L2924/01005H01L2924/01033H01L2224/45144H01L2224/73265H01L2224/48799H01L2224/85181H01L24/73H01L2224/45H01L2224/45015H01L2224/78H01L2224/85H01L2224/85045H01L2924/00011H01L2924/00014H01L2224/45647H01L2224/45624H01L2224/45639H01L2224/45644H01L2924/00012H01L2224/48824H01L2924/00H01L2924/20752H01L2924/01049
Inventor 王德峻
Owner ASE ASSEMBLY & TEST SHANGHAI