Film forming system and film forming method

A technology of a film forming device and a film forming method, which is applied in the directions of spraying device, liquid spraying device, and device for coating liquid on the surface, etc. Contamination and other problems, to achieve the effect of improving material utilization efficiency, improving work efficiency, and preventing the reduction of film thickness uniformity

Active Publication Date: 2010-12-08
KK TOSHIBA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, in this method, since the coating is performed on a spiral trajectory, and the coating nozzle moves along the spiral trajectory in a state close to the substrate, the coating

Method used

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  • Film forming system and film forming method
  • Film forming system and film forming method
  • Film forming system and film forming method

Examples

Experimental program
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Embodiment Construction

[0024] One embodiment of the present invention will be described with reference to the drawings.

[0025] Such as figure 1 As shown, a film forming apparatus 1 according to an embodiment of the present invention includes a stage 2 on which a wafer W as an object to be coated is placed, a rotation mechanism 3 that rotates the stage 2 in a horizontal plane, and feeds the material from the front end to the stage. The wafer W on the frame 2 is discharged, the coating nozzle 4 for coating, the moving mechanism 5 that moves the coating nozzle 4 and the stage 2 relatively in the horizontal plane direction, and the image of the coating nozzle 4 in the process of discharging the material is acquired The image acquisition section 6 of the coating nozzle 4 is cleaned, the cleaning device 7 for cleaning the coating nozzle 4, the inspection device 8 for checking the contamination of the coating nozzle 4, the observation device 9 for observing the film surface of the coating film M on the w...

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PUM

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Abstract

The invention increases the material utilization efficiency and operating rate and prevents reduction of film thickness uniformity owing to pollution on a nozzle. According to one embodiment, a film forming system includes: a stage including a placement surface on which an object to be coated is placed; a rotating mechanism rotating the stage in a rotational direction along the placement surface; an application nozzle discharging a material onto the object placed on the stage for application; a moving mechanism relatively moving the stage and the application nozzle along the placement surface in a cross direction crossing the rotational direction; a controller performing a control to rotate the stage on which the object is placed through the rotating mechanism while relatively moving the stage and application nozzle along the placement surface in the cross direction through the moving mechanism and applying the material to the object on the stage through the application nozzle; and a cleaning apparatus cleaning the application nozzle.

Description

technical field [0001] The present invention relates to a film forming device and a film forming method, for example, relates to a film forming device and a film forming method for coating a material on an object to be coated and forming a coating film. Background technique [0002] In the field of semiconductors and the like, when forming a circular film on a disc-shaped substrate, it is required to make the film thickness deviation within 0.1 to 1.0 μm. In order to achieve this target range, the film is formed by the spin coating method. . In this spin coating method, a disc-shaped substrate is fixed on a circular rotating stand, and after a necessary amount of material is applied to the center of the substrate, the rotating stand is rotated at a high speed, and the rotating stand is placed on the rotating stand by centrifugal force. A method in which a material is spread over the entire surface of a substrate to form a film. [0003] In this case, the material usage eff...

Claims

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Application Information

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IPC IPC(8): B05B13/04B05B15/02B05B9/04B05D1/02B05D1/40H01L21/00
CPCB05C5/0291B05B15/0266B41J2/165B05C5/0216B05C11/08H01L21/6715B05D1/005H01L21/67051B05B15/025B41J2/16579B05B12/08B05B12/084B05B15/555B05B15/557B05B15/52B05B15/55B05D1/40H01L21/0274
Inventor 大城健一佐藤强德本隆男夏贞雄岩崎聪一郎
Owner KK TOSHIBA
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