Film forming system and film forming method

Abstract

The invention increases the material utilization efficiency and operating rate and prevents reduction of film thickness uniformity owing to pollution on a nozzle. According to one embodiment, a film forming system includes: a stage including a placement surface on which an object to be coated is placed; a rotating mechanism rotating the stage in a rotational direction along the placement surface; an application nozzle discharging a material onto the object placed on the stage for application; a moving mechanism relatively moving the stage and the application nozzle along the placement surface in a cross direction crossing the rotational direction; a controller performing a control to rotate the stage on which the object is placed through the rotating mechanism while relatively moving the stage and application nozzle along the placement surface in the cross direction through the moving mechanism and applying the material to the object on the stage through the application nozzle; and a cleaning apparatus cleaning the application nozzle.

Description

technical field [0001] The present invention relates to a film forming device and a film forming method, for example, relates to a film forming device and a film forming method for coating a material on an object to be coated and forming a coating film. Background technique [0002] In the field of semiconductors and the like, when forming a circular film on a disc-shaped substrate, it is required to make the film thickness deviation within 0.1 to 1.0 μm. In order to achieve this target range, the film is formed by the spin coating method. . In this spin coating method, a disc-shaped substrate is fixed on a circular rotating stand, and after a necessary amount of material is applied to the center of the substrate, the rotating stand is rotated at a high speed, and the rotating stand is placed on the rotating stand by centrifugal force. A method in which a material is spread over the entire surface of a substrate to form a film. [0003] In this case, the material usage eff...

AI Technical Summary

Problems solved by technology

However, in this method, since the coating is performed on a spiral trajectory, and the coating nozzle moves along the spiral trajectory in a state close to the substrate, the coating nozzle is easily contaminated compared with the spin coating method. Due to this contamination, the variation in film thickness increases, so the uniformity of film thickness decreases

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