Printed circuit board testing device and testing method
A technology of printed circuit boards and inspection devices, which is applied in the direction of measuring devices, instruments, measuring electricity, etc.
Active Publication Date: 2014-03-26
MICROCRAFT
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- Description
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- Application Information
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[0013] However, in the inspection methods described in the aforementioned Patent Documents 4 to 6, since the waveform evaluation is performed in the evaluation of the inspection results, there is a problem that an expensive measuring instrument such as a transient digital analyzer is required.
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[0034] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In addition, in all the drawings for describing the embodiment, in principle, the same reference numerals are assigned to the same components, and overlapping description thereof will be omitted. In addition, unless otherwise specified, symbols indicating terminal names also serve as line names and signal names, and in the case of power supplies, may also serve as their voltage values.
[0035] figure 1 The overall structure of the printed wiring board inspection apparatus in one embodiment of this invention is shown. The printed wiring board inspection device in this embodiment is constituted by, for example, two probes 1 , a probe support unit 2 , a movement mechanism unit 6 , a measurement unit 7 , a storage unit 8 , a control unit 9 and the like.
[0036] The moving mechanism unit 6 is composed of various motors, a motor driver for driving the motors, and ...
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The invention relates to a printed circuit board testing device and a testing method. The method comprises the following steps: contacting a first probe with a base surface of a to-be-tested printed circuit board, contacting a second probe with the circuits of the printed circuit board, exerting a square-wave voltage on a circuit through the second probe, using the first probe to perform the first voltage measurement after exerting the rectangular pulse, and a second voltage measurement after passing the optimum measuring setup in order to judge the insulating resistance, performing the voltage measurement to all circuits of the printed circuit board, comparing the first measured value and the second measured value of the beforehand measuring good products, and the measured first measured value and the second measured value, performing detection of bad conducting resistor increase containing the complete yarn cutting in the same circuit based on the first measured value, performing the detection of bad insulating resistance reduction containing the dead short circuit with the adjacent circuit based on the second measured value.
Description
technical field [0001] The present invention relates to an inspection device and inspection method of printed wiring boards, and more particularly to an inspection device and inspection method of printed wiring boards for finding disconnection defects and short circuit defects of circuits (net: lines) in printed wiring boards. Background technique [0002] In general, a printed wiring board has a plurality of circuits that are electrically connected using wiring patterns, through holes, etc., and it is necessary to check electrically whether the circuits of the manufactured printed wiring board are correctly formed as designed, that is, the Whether the circuit does not have a bad disconnection or a short circuit with other circuits, and whether it is formed according to the design. [0003] As an electrical inspection method for short-circuit inspection, it is known to apply a voltage between the circuits to be inspected, obtain the insulation resistance between the circuits...
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IPC IPC(8): G01R31/02
Inventor 秀平赖夫
Owner MICROCRAFT