Carrier tape traction adhesive tape applied to automatic die bonding process and application method thereof
An automatic patch and tape technology, applied in the direction of film/sheet adhesives, adhesives, electrical components, etc., can solve problems such as jamming and inaccurate positioning, and achieve the effect of convenient use, easy positioning and simple structure
Active Publication Date: 2013-09-18
SHENZHEN KHJ TECH
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AI Technical Summary
Problems solved by technology
[0005] The technical problem to be solved by the present invention is to provide an automatic placement machine for the above-mentioned shortcomings that the single-sided connection film of the automatic placement material tape connecting the extension tape will jam the feeder of the automatic placement machine and the positioning is inaccurate. The material belt traction tape of the process will not jam the feeder of the automatic placement machine, and the structure is simple and the positioning is accurate
Method used
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Embodiment Construction
[0029] Such as Figure 3-4 As shown, it is a schematic diagram of a preferred embodiment of the tape traction tape 10 used in the automatic chip placement process of the present invention; image 3 The shown anti-adhesive backing paper 6 is in a half-open state, Figure 4 Then the side surface of the tape traction tape is clearly enlarged and displayed. The strip traction tape 10 for the automatic placement process includes an extension tape 4, an adhesive layer 5 arranged at one end of the extension adhesive tape 4, and an anti-adhesive backing paper 6 pasted on the adhesive layer 5. In this embodiment , the extension tape 4 is a transparent plastic tape, and one end for setting the adhesive layer 5 is set as the sticking end 41, and the connecting end 42 is extended from the sticking end 41. It can be understood that the extending tape 4 is made of a thicker material. Compared with the single-sided connecting film, the transparent plastic tape with better hardness is easie...
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The invention relates to a carrier tape traction adhesive tape applied to an automatic die bonding process and an application method thereof. The carrier tape traction adhesive tape comprises an extension adhesive tape and release backing paper, one end of the extension adhesive tape is set as the adhesion end, one side of the adhesion end is provided with an adhesive layer, the release backing paper is stuck to the adhesive layer; and the extension adhesive tape is arranged smoothly opposite to the other side of the adhesive layer.The application method of the carrier traction tape comprises the following steps: pulling an electronic component carrier tape out of a tape feed roller; taking away the release backing paper and sticking the adhesive layer exposed by the adhesion end of the extension adhesive tape to a plastic film of the electronic element carrier tape; finally, conveying the connection end of the extension adhesive tape into a feeder of the an automatic die bonding machine to be fixed.In the invention, the adhesive layer is arranged at the adhesion end of the extension adhesive tape to stick the plastic film of the carrier tape, the structure of the traction adhesive tape is simple, when the extension adhesive tape is conveyed into the feeder, the situation that the feeder gets stuck does not occur; and in addition, because that the adhesive layer is colored, the adhesive layer can accurately stick to the carrier tape, thereby being convenient to use.
Description
technical field [0001] The present invention relates to the automatic placement process of electronic components, more specifically, relates to a material tape traction tape used in the automatic placement process and its use method, using the material tape traction tape as the material tape of the electronic component carrier and the automatic paste The bonding tape between the feeders in the chip machine is used. Background technique [0002] With the development of electronic technology, the installation process of electronic components is also constantly improving, wherein the automatic placement process for installing electronic components has been widely used. In the automatic placement process, the electronic components are preset in the component pits of the tape and fixed with a plastic film. The chip machine gradually opens the plastic film and pastes the electronic components to the appropriate position on the circuit board. However, the existing automatic place...
Claims
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IPC IPC(8): C09J7/02H05K13/02
Inventor 练群
Owner SHENZHEN KHJ TECH