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Driver module structure

A driving module and structure technology, applied in semiconductor/solid-state device manufacturing, electrical components, electric solid-state devices, etc., to achieve high reliability

Inactive Publication Date: 2010-12-22
PANASONIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In the drive module structure described in Patent Document 1, since it is necessary to provide a through hole in the flexible substrate, there is a restriction on the layout of the wiring pattern formed on the flexible substrate.

Method used

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no. 1 approach

[0045] refer to Figure 1 to Figure 2 , taking a plasma display panel (hereinafter referred to as PDP) driving device as an example, the structure of the driving module according to the first embodiment of the present invention will be described. figure 1 It is an exploded perspective view of a PDP drive device that is an example of the drive module according to the first embodiment of the present invention. figure 2 yes figure 1 Cross-sectional view of the PDP drive unit. image 3 It is a figure of the inner peripheral wall of the recessed part of a radiator seen from the inside.

[0046] Such as figure 1 and figure 2 As shown, the PDP drive device 1 has a flexible substrate 2 , a semiconductor device 3 assembled on the flexible substrate 2 , and a radiator 4 mounted on the flexible substrate 2 .

[0047] The flexible substrate 2 is formed of a flexible plastic film, has an electrode 5 connected to the PDP at one end, and an electrode 6 connected to a control substrate...

no. 2 approach

[0067] The following reference Figure 4 A PDP drive device according to a second embodiment of the present invention will be described. Figure 4 It is a perspective view of a PDP drive device which is an example of the drive module according to the second embodiment of the present invention. also, Figure 4 in, with figure 1 The same structure is marked with the same symbol, and the explanation is omitted.

[0068] In the PDP drive device 1x according to the second embodiment, grooves 8x functioning as air passages formed in the radiator 4x are respectively formed in the center of the two long sides of the rectangular concave portion 41 . The groove 8x is preferably substantially V-shaped in cross section, similarly to the groove 8 described in the radiator 4 according to the first embodiment.

[0069] In the radiator 4x formed with such grooves 8x, even if grease infiltrates into one of the grooves 8x, the other groove 8x at a position opposite to the one groove 8x can ...

no. 3 approach

[0071] The following reference Figure 5 A PDP drive device according to a third embodiment of the present invention will be described. Figure 5 It is a perspective view of a PDP drive device which is an example of the drive module according to the third embodiment of the present invention. also, Figure 5 in, with figure 1 The same symbols are attached to the same structures, and the description thereof will be omitted.

[0072] In the PDP drive device 1y according to the third embodiment, the grooves 8y functioning as air passages formed in the radiator 4y are formed in four directions from the four corners of the concave portion 41 formed in a rectangular shape with the concave portion 41 as the center. extend. Even if the groove 8y is formed in the radiator 4y in this way, the same effect as that of the first embodiment can be obtained.

[0073] By forming the grooves 8y to extend in four directions from the four corners of the recess 41 around the recess 41, the bon...

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Abstract

Provided is a driver module structure which can ensure high reliability. A PDP driver device (1) is provided with a flexible substrate (2) wherein a wiring pattern is formed, a semiconductor device (3) mounted on the flexible substrate (2), and a heat dissipating body (4) having a recessed section (41) formed thereon for storing the semiconductor substrate (3). The heat dissipating body (4) is provided with four grooves (8), each of which has a substantially V-shaped cross-section, as ventilation paths for connecting a space inside the recessed section (41) with the external.

Description

technical field [0001] The present invention relates to a drive module structure including a flexible substrate on which a semiconductor device is mounted and a heat sink from which heat generated by the semiconductor device is dissipated. Background technique [0002] A semiconductor device that controls a display device such as a flat panel display is assembled on a flexible substrate and used as a drive module for the display device. For example, the invention described in Patent Document 1 is known as a conventional drive module. [0003] The drive module structure described in this patent document 1 includes: a flexible substrate on which a semiconductor device is assembled and a heat sink formed with a recess forming a space for accommodating the semiconductor device; Connected vias. The through hole is for releasing the air in the space formed by the concave portion to the outside. Since the through holes are provided on the flexible substrate, even if the air in t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/36H01L21/60
CPCH01L23/36H01L2924/14H01L2924/0002H01L23/4985H01L23/3675H01L23/467H01L2924/00
Inventor 山口聪哉汤元重夫上国料浩文山元庆太
Owner PANASONIC CORP
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