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Method for cutting off brittle material substrate

A brittle material substrate, substrate technology, applied in the direction of stone processing equipment, glass cutting equipment, stone processing tools, etc., to achieve the effect of inhibiting the generation of micro-cracks or glass shavings

Inactive Publication Date: 2010-12-29
MITSUBOSHI DIAMOND IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0012] The object of the present invention is to overcome the defects of the existing brittle material substrate cutting method and provide a new brittle material substrate cutting method. It is very suitable for practical use because it can minimize the occurrence of microcracks and glass shavings, etc.

Method used

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  • Method for cutting off brittle material substrate
  • Method for cutting off brittle material substrate
  • Method for cutting off brittle material substrate

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Embodiment Construction

[0036] In order to further explain the technical means and effects of the present invention to achieve the intended purpose of the invention, the specific implementation methods, methods, steps, Features and their functions are described in detail below.

[0037] figure 1 (a) to figure 1 (c) is a process diagram showing an embodiment of the cutting method of the brittle material substrate of the present invention. figure 1 It is a process diagram in the case of cutting the glass substrate 1 which is a brittle material substrate with the line 11 to cut. as figure 1 As shown in (a), an initial crack 31 is first formed at the cutting start end As of the surface 10a of the glass substrate 1 by the cutter wheel 2 . The length and depth of the initial cracks 31 are not particularly limited, but usually the length of the initial cracks 31 is preferably in the range of 1 to 30 mm, more preferably in the range of several mm. In addition, the depth of the initial crack 31 is prefer...

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Abstract

The invention provides a method for cutting off a brittle material substrate, capable of preventing the micro slight cracks or glass shreds or the like from generating to the maximum with no cause of the large-scale and complex of the apparatus, including: firstly, forming initial cracks at the cutting beginning end of a cutting-off predetermined line on one side of a glass substrate with a knife, secondly, pressing the part of the opposite side surface of the glass substrate surface formed with the initial cracks, opposite to the initial cracks with a broken rolling wheel to drive the initial cracks to advance to the thickness direction of the substrate to form the initial through cracks reaching the opposite side surface, then, moving the laser beam from the initial through cracks along the cutting-off predetermined line and irradiating simultaneously, heating the glass substrate at the temperature below the melting temperature, so as to advance the initial through cracks along the cutting-off predetermined line by the thermal stress generated on the substrate to cut off the glass substrate along the cutting-off predetermined line.

Description

technical field [0001] The invention relates to a method for cutting brittle material substrates such as glass substrates or ceramic substrates by laser irradiation. Background technique [0002] Conventionally, as a method of cutting brittle material substrates such as glass substrates or ceramic substrates, it is widely used to press a cutter wheel or the like on the surface of a brittle material substrate and rotate it simultaneously to form cracks in a direction approximately perpendicular to the surface of the brittle material substrate (hereinafter It is called a "vertical crack"), and then a mechanical pressing force is applied to the substrate to cause the vertical crack to develop in the thickness direction of the substrate to cut the substrate. [0003] However, in general, when a cutter wheel is used to form vertical cracks in a brittle material substrate, small fragments called glass cullets are generated, and the glass cullets may cause scratches on the surface ...

Claims

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Application Information

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IPC IPC(8): B23K26/00B23K26/42C03B33/09B28D1/24B23K26/38B28D5/00C03B33/07
CPCB23K26/382C03B33/0222C03B33/03C03B33/033C03B33/082C03B33/091Y02P40/57
Inventor 井村淳史塚田义隆
Owner MITSUBOSHI DIAMOND IND CO LTD
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