Thermal contact resistance testing device with cooling device

A cooling device and contact thermal resistance technology, applied in the field of testing, can solve the problems of impractical engineering, many parameters, large errors, etc., to avoid errors, improve work efficiency, and avoid lateral heat flow loss.

Inactive Publication Date: 2010-12-29
BEIHANG UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, these methods have many parameters and la

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  • Thermal contact resistance testing device with cooling device
  • Thermal contact resistance testing device with cooling device
  • Thermal contact resistance testing device with cooling device

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Embodiment Construction

[0023] The present invention will be described in detail below in conjunction with the accompanying drawings and embodiments.

[0024] The invention provides a method for testing thermal contact resistance. The testing method utilizes the characteristics of temperature change of heat flow transmitted between different material interfaces to detect thermal contact resistance of the interface. Therefore, this method is relatively simple, reliable, and has high measurement accuracy and is easy to use. Operational test equipment will do. However, due to the need for sufficient heat exchange between the temperature measuring element and the surrounding medium, it takes a certain amount of time to achieve thermal equilibrium, so the data after reaching a steady state is credible. Based on the above factors, the contact thermal resistance testing method provided by the present invention is specifically realized through the following steps:

[0025] The first step is the preparation ...

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Abstract

The invention discloses a thermal contact resistance testing device with a cooling device, which mainly comprises a support, a top plate, a bottom plate, a stress loading device, the cooling device, a data acquisition system and a heating device, wherein the heating device, a test sample, the cooling device and the stress loading device are arranged between the bottom plate and the top plate from bottom to top in sequence. The cooling device is arranged at the top end of the test sample and is a cooling water tank, the center of the cooling water tank is provided with a central through hole, and the inner diameter of the central through hole is greater than the outer diameter of a force conducting rod. The temperature of cooling water in the cooling water tank is directly conducted to the force conducting rod, and the upper cold end of the test sample is cooled by reducing the temperature of the force conducting rod. A cooling channel is arranged in the cooling water tank, is spiral and surrounds the central through hole, a cooling water inlet is arranged at the bottom of the cooling water tank, and the top is provided with a cooling water outlet. The hot end and the cold end of the test sample have great temperature difference by using the cooling device, and the one-dimensional axial transmission of a heat flow is realized.

Description

technical field [0001] The invention belongs to the technical field of testing, and specifically relates to a method and equipment for testing thermal contact resistance, which is suitable for testing thermal contact resistance in different temperature and loading stress ranges, and especially capable of testing thermal contact resistance under high temperature and high contact stress conditions condition. Background technique [0002] When the surfaces of two objects come into contact with each other, no matter how smooth the surfaces are, there are always microscopic incomplete contact points. The contact surface of an object is composed of scattered small contact points, which are separated by large gaps, which may be vacuum or filled with heat transfer medium. Therefore, in addition to the inherent thermal resistance at the contact surface, there is an additional heat transfer resistance - contact thermal resistance. Contact resistance is an important parameter in many...

Claims

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Application Information

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IPC IPC(8): G01N25/20
Inventor 王宗仁张卫方侯卫国崔本仓唐庆云刘肖丁美丽王晓亮姚婧
Owner BEIHANG UNIV
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