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Packaging method of photoelectric component and packaging carrier structure thereof

A technology of optoelectronic components and packaging methods, which is applied in the direction of electrical components, electrical solid devices, circuits, etc., and can solve problems that affect the performance of optoelectronic components and packaging materials that are not resistant to high temperatures

Inactive Publication Date: 2010-12-29
普照光电科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Furthermore, the light-emitting chip with double-sided electrodes must be accompanied by high heat when it emits light; and the packaging material of the optoelectronic component itself is not resistant to high temperature, so when the number of light-emitting chips in the packaging material increases, the light-emitting chip and the packaging material will quickly degrade due to high temperature. Qualitative changes occur, causing the photoelectric components to experience the so-called light attenuation and color attenuation, which seriously affects the performance of optoelectronic components

Method used

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  • Packaging method of photoelectric component and packaging carrier structure thereof
  • Packaging method of photoelectric component and packaging carrier structure thereof
  • Packaging method of photoelectric component and packaging carrier structure thereof

Examples

Experimental program
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Embodiment 1

[0035] Such as figure 1 , 2 As shown, the packaging method of the optoelectronic component of the present invention includes the following steps: 1) providing a substrate 11; 2) constructing at least one internal electrode metal material 12 and at least one liner metal material 13 on at least one side of the substrate 11 and an external electrode metal material 14; 3) selectively solder at least one double-sided electrode light-emitting chip 21 on the at least one internal electrode metal material 12; 4) selectively fix at least one planar electrode light-emitting chip 22 on the On the at least one pad metal material 13; 5) use gold wire 30 to complete the electrical connection between the at least one double-sided electrode light-emitting chip 21 and the at least one planar electrode light-emitting chip 22 and the external electrode metal material 14; 6) finally At least one packaging material 40 is wrapped around each double-sided electrode light-emitting chip 21 , each pla...

Embodiment 2

[0044] Such as Figure 6 As shown, the difference between this embodiment and Embodiment 1 is that: the at least one internal electrode metal material 12 can be directly used to electrically connect with the external circuit, so the solder resist layer 16 is opposite to the at least one internal electrode metal material 12 is provided with at least two windows 161, 162, so that the exposed portion of the internal electrode metal material 12 relative to the window 161 becomes the welding pad 121 electrically connected to the double-sided electrode light-emitting chip 21 and the internal electrode metal material 12. The exposed portion of 162 serves as a pad 122 for electrically connecting the internal electrode metal material 12 to an external circuit.

[0045] The substrate 11 is provided with at least two external electrode metal materials 14, and each external electrode metal material 14 is separated from each internal electrode metal material 12 and each liner metal materia...

Embodiment 3

[0047] Such as Figure 7 As shown, the difference between this embodiment and Embodiment 1 or 2 lies in that the structure of the overall packaging carrier depends on the application, and at least two internal electrode metal materials 12 are provided on the same substrate 11. When in use, at least two internal electrode metal materials 12 are arranged. The two double-sided electrode light-emitting chips 21 are respectively welded on the corresponding internal electrode metal material 12, and the internal electrode metal material 12 can be used to achieve heat dissipation, effectively solving the problem that the double-sided electrode light-emitting chip 21 is accompanied by high heat while emitting light; in addition, each The planar electrode light-emitting chip 22 can be fixed on the same backing metal material 13 with thermally conductive adhesive, and the backing metal material 13 can also be used to achieve heat dissipation, thus effectively improving the color rendering...

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PUM

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Abstract

The invention discloses a packaging method of a photoelectric component and a packaging carrier structure thereof. The method comprises: constructing at least an internal electrode metal material, at least on liner metal material and at least one external electrode metal material on one side plate of a substrate so as to form a photoelectric component packaging carrier structure in which at least one double-side electrode light emitting chip is welded on the internal electrode metal material selectively and in which at least panel electrode light emitting chip is fixedly arranged on the linear metal structure selectively; and electrically connecting the double-side electrode light emitting chips and the plane electrode light emitting chips to the external electrode metal materials by using gold wires, and coating at least one packaging material on the double-side electrode light emitting chips, the plane electrode light emitting chips and the gold wires to accomplish the packaging of the photoelectric component. In the invention, the color rendering of the photoelectric component is improved, and high radiation efficiency is achieved.

Description

technical field [0001] The invention relates to a packaging method of a photoelectric component and a packaging carrier structure thereof. Background technique [0002] Light-emitting diodes have gradually become the fastest-growing light-emitting components due to their advantages such as power saving, long life, low driving voltage, and fast response. With the rapid development of light-emitting diode (LED) technology and related peripheral integration As circuit control components and heat dissipation technologies become more and more mature, the application fields of optoelectronic components using light-emitting diodes as light-emitting chips are becoming more and more diversified. [0003] The light-emitting principle of light-emitting diode photoelectric components is to emit light of a specific wavelength through the electro-optical (Electro Luminescence) conversion effect; for example, a yellow fluorescent layer is directly coated on a single light-emitting chip, an...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/60H01L25/075H01L33/62
CPCH01L2224/48137H01L2224/45144H01L2224/48091H01L2924/00014H01L2924/00
Inventor 陈元杰
Owner 普照光电科技股份有限公司