Static pressure blister test fine loading control method

Abstract

The invention discloses a static pressure blister test fine loading control method, which comprises the following steps of: connecting two organic glass containers (the internal diameters are R1 and R2, and the R1 is less than or equal to the R2) with graduated scales by using a communicating pipe, firmly adhering a substrate of a sample to be detected and the upper top of the small container to close the upper space of the small container, and then injecting liquid with color into the large container, wherein because of gravity, the fluid flows into the small container through the communicating pipe to compress air in the small container to generate an air pressure (namely uniform load) acted on a coating film, and the purpose of fine loading control can be fulfilled by finely controlling the injection speed and the injection quantity of the liquid so as to realize layered control (namely blister size control) between the coating film and the substrate. The method solves the problems of difficult loading control in the conventional fluid static pressure loading method and dissolution, humidity and the like caused by direct contact of the fluid and the coating film, and can utilize accurate mechanical solution.

Description

technical field The present invention relates to a method for studying the interface adhesion strength (adhesion energy) between coating films (coating films) and substrates (substrates) by means of bubbler tests, in particular to a method for applying hydrostatic pressure loading A method for fine loading control of the coating film and fine control of the bubble size in the bubble test. Background technique Thin-film technology has been widely used in many fields, such as protective coatings, decorative coatings, and thin-film devices in the microelectronics industry and optoelectronics industry. For protective coatings or decorative coatings, ie coating film-substrate structures, the reliability, stability, lifetime, etc. of film-substrate systems require a better understanding of the mechanical behavior of thin layer structures. It is currently a popular practice in the world to use peel tests or blister tests to study the interfacial adhesion strength (adhesion energy)...

AI Technical Summary

Problems solved by technology

Aiming at the defects and deficiencies in the prior art, the present invention provides a fine loading control scheme suitable for pressurized blister tests, which realizes both convenient fine loading control and bubble size It also solves the problems of dissolution and moisture in the previous hydrostatic loading method, and can also use the exact solution to improve the accuracy and correctness of the research results

In general, whether the exact solution of the loading structure can be obtained should be an important basis for choosing the loading method of the bubble test! The present invention focuses on using the accurate Hencky solution, while solving the problems of loading and bubble size control in the previous hydrostatic loading method, as well as the disadvantages of dissolution, moisture, etc.

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